东芝nand flash资料 1. HISTORY OF FLASH AT TOSHIBA 2. HOW FLASH WORKS 3. THE NAND FLASH INTERFACE 4. HARDWARE INTERFACING 5. LARGE BLOCK VS. SMALL BLOCK NAND 6. FAILURE MODE OVERVIEW 7. MANAGING NAND FLASH 8. TIPS FOR USING NAND FLASH 9. INTRODUCTION TO
东芝emmc芯片手册,THGBMBG9D8KBAIG is 64GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG9D8KBAIG has an industry standar