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● SUGGESTED REFLOW PROFILE(回流焊曲线图)
Total time:200 sec. Max.(总时间:200秒最大)
Solder melting point:220℃(熔点220℃)
Profiles feature(特性)
Pb-Free assembly
Average Ramp- up rate( Ts max to Tp)平均升温速度
3℃C/ second max
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Z-Wave多通道基础资料,介绍设备类型及命令类规范,描述基本的多通道功能,关联组及生命组规范。APL12955-7
Z-Wave Multi channel basics
2018-03-06
Z-WAVE MULTI CHANNEL BASICS
Z-Wave enables a variety of monitoring and control applications. Sensors can send data to a gateway
Wall controllers may rep