1 Introduction 1 1.1 Motivation 1 1.2 System in Package (SiP): chip and package co-design 13 1.3 Future wireless communication systems 13 1.4 Circuits and electromagnetic simulation 15 2 Capacitance 18 2.1 Electrostatics review 18 2.2 Capacitance 32

光纤参量放大器，谐振器与相关器件。This is the first book to provide comprehensive coverage of the theory and practice of OPAs and related devices, including fiber optical parametric oscillators (OPOs).

焦平面耦合文章 Abstract—A focal plane array feed of electrically small elements has been proposed as a means for achieving high sensitivity for radio astronomy applications in the presence of radio frequency in- terference (RFI). For a broadband system, mu

The work presented in this thesis will focus on design of different power amplifiers for millimeter-wave operating frequencies.