The PowerPAD™ thermally enhanced package provides greater design flexibility and increased thermal efficiency in a standard size device package. The PowerPAD package’s improved performance permits higher clock speeds, more compact systems and more a
The TPS5430 device is available in a thermally www.ti.com/swift enhanced, easy to use 8-pin SOIC PowerPAD™ package. TI provides evaluation modules and the SWIFT™ Designer software tool to aid in quickly achieving high-performance power supply design
• 125 Msps Sample Rate Msps analog-to-digital converter (ADC). To provide a • High SNR: 71.2 dBFS at 100-MHz fIN complete converter solution, it includes a • High SFDR: 82 dBc at 100-MHz fIN and internal reference. Designed for applications • 2.3-VP
4.5 V to 42 V (45 V Abs Max) Input Range • 3.5 A Continuous Current, 4.5 A Minimum Peak Inductor Current Limit • Current Mode Control DC-DC Converter • 92-mΩ High-Side MOSFET • High Efficiency at Light Loads with Pulse Skipping Eco-mode™ • Low Dropo
