Low-voltage and Standard-voltage Operation – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 5.5V) • Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K) • Two-wire Serial Interface • Schmitt Trigger, Filtered
Descr iption 16K (2048 x 8) The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimize
Content 1. Sensor Overview 1.1 General Descr iption 1.2 Features 1.3 Application 1.4 Technical Specifications 1.5 Block Diagram 1.6 Pixel Array 2. Color Filter Spectral Characteristics 3. Two-wire Serial Bus Communication 3.1 Protocol 3.2 Serial Bus
Content 1. Sensor Overview 1.1 General Descr iption 1.2 Features 1.3 Application 1.4 Technical Specifications 1.5 Block Diagram 1.6 Pixel Array 2. Color Filter Spectral Characteristics 3. Two-wire Serial Bus Communication 3.1 Protocol 3.2 Serial Bus
I2C is a two-wire, bi-directional serial bus that provides a simple and efficient method of data exchange between devices. It is most suitable for applications requiring occasional communication over a short distance between many devices.
Features • Array format: Wide-VGA, active 752H x 480V (360,960 pixels) • Global shutter photodiode pixels; simultaneous integration and readout • Monochrome or color: Near_IR enhanced performance for use with non-visible NIR illumination • Readout m
MT9J003数据手册，开发必备。 1/2.3-Inch 10Mp CMOS Digital Image Sensor MT9J003 Data Sheet。 Features • 1080p digital video mode • Simple two-wire serial interface • Auto black level calibration • Support for external mechanical shutter • Support for external LE
I²C (Inter-Integrated Circuit, referred to as I-squared-C, I-two-C, or IIC) is a multimaster serial single-ended computer bus invented by Philips used for attaching low-speed peripherals to a motherboard, embedded system, cellphone, or other electro
13 Mp CMOS sensor with advanced 1.1 m pixel BSI technology • Data interfaces: two-, three-, and four-lane serial mobile industry processor interface (MIPI) • Bit-depth compression available for MIPI Interface: 10-8 and 10-6 to enable lower bandwidt
The emergence of the new advanced package technology chip scale package (CSP) in the semiconductor industry has been increasingly becoming popular. In this study, the focus will be made on the CSP package types using wire bonding interconnect techno
The Application of DIN Rail 3 Two-wire 4-20mA Isolation Transmitter/Isolator/Distributorpdf,The Application of DIN Rail 3 Two-wire 4-20mA Isolation Transmitter/Isolator/Distributor
