最新版本的axis2c Apache Axis2/C What is it? ----------- The Apache Axis2/C is a SOAP engine implementation that can be used to provide and consume Web Services. Axis2/C is an effort to implement Axis2 architecture, in C. Please have a look at http://ws.a
Writing Testbenches using System Verilog 英文原版的，学起来比较容易。 Writing Testbenches using System Verilog About the Cover xiii Preface xv Why This Book Is Important . . . . . . xvi What This Book Is About . . . . . . . . xvi What Prior Knowledge You Should H
Digital Engineer to Signal Integrity Engineer In 28 Hours 1 Introduction Data rates in digital systems have been increasing at a quick pace. Digital systems architectures have evolved over the last few years from synchronous bus interconnections, to
The 4Gb Double-Data-Rate-3 (DDR3(L)) DRAM is a high-speed CMOS SDRAM containing 4,294,967,296 bits. It is internally configured as an octal-bank DRAM. The 4Gb chip is organized as 64Mbit x 8 I/O x 8 banks and 32Mbit x16 I/O x 8 banks. These synchron
DOUBLE DATA RATE(DDR) SDRAM VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V • Bidirectional data strobe (DQS) transmitted/ received with data, i.e., source-synchronous data capture (x16 has two – one per byte) • Internal, pipelined double-data-rate (DDR) arch
The timing of I/O interfaces can present some challenges for users of STA tools. This paper will discuss using PrimeTime to tackle one of todays common I/O timing problems – the Double Data Rate (DDR) interface. Building on the techniques for sourc
《High Speed SerDes Devices and Applications [ISBN_ 978-0387798332]》David Robert Stauffer.pdf
《高速SerDes器件和应用》 [ISBN_ 978-0387798332]David Robert Stauffer 英文版Davide. stauffer
Jeanne T mechler
IBM Corporation
IBM Corporation
Essex junction. VT
Essex jun
HSIC High-Speed Inter-Chip USB Electrical Specification 官方文档High-Speed Inter-Chip USB vsn 1.0
September 23, 2007
The 1.0 revision of the specification is intended for product design. Every attempt has been made to
ensure a consistent and implementabl
LATTICE-ECP3-datasheet 莱迪斯ecp3器件系列的数据手册The LatticeECP3TM(EConomy Plus Third generation) family of fpga devices is optimized to deliver high perfor-
mance features such as an enhanced dsP architecture, high speed serdeS and high speed source synchrono
We investigate the characteristics of the dual-forward synchronously pumped L-band erbium-doped superfluorescent fiber source (SFS). The effects of pump ratio and fiber length arrangements on the output characteristics of the L-band SFS in terms of m
