文件名称:
AD590 Note that the chip
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文件大小: 213kb
下载次数: 0
上传时间: 2010-06-04
详细说明： The 590H has 60 ?inches of gold plating on its Kovar leads an Kovar header. A resistance welder is used to seal the nickel cap to the header. The AD590 chip is eutectically mounted to the header and ultrasonically bonded to with 1 MIL aluminum wire. Kovar composition: 53% iron nominal; 29% ?% nickel; 17% ?1% cobalt; 0.65% manganese max; 0.20% silicon max; 0.10% aluminum max; 0.10% magnesium max; 0.10% zirco- nium max; 0.10% titanium max; 0.06% carbon max. The 590F is a ceramic package with gold plating on its Kovar leads, Kovar lid, and chip cavity. Solder of 80/20 Au/Sn com- position is used for the 1.5 mil thick solder ring under the lid. The chip cavity has a nickel underlay between the metalization and the gold plating. The AD590 chip is eutectically mounted in the chip cavity at 410 and ultrasonically bonded to with 1 mil aluminum wire. Note that the chip is in direct contact with the ceramic base, not the metal lid. When using the AD590 in die form, the chip substrate must be kept electrically isolated, (floating), for correct circuit operation. ...展开收缩
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