开发工具:
文件大小: 28mb
下载次数: 0
上传时间: 2012-05-11
详细说明： The OMAP36xx high-performance, multimedia application device is based on the enhanced OMAP™ 3 architecture and is integrated on TI advanced 45-nm process technology. The architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • 2-dimension/3-dimension (2D/3D) mobile gaming • Video conferencing • High-resolution still image • Video capture in 2.5G wireless terminals, 3G wireless terminals, rich multimedia-featured handsets, and high-performance personal digital assistants (PDAs) The device supports high-level operating systems (OSs) such as: • Android™ OS • Linux® • Symbian OS™ • Windows® CE This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor • Imaging video and audio (IVA2.2) subsystem with a TMS320C64x™ digital signal processor (DSP) core • POWERVR® SGX530 subsystem for 2D and 3D graphics acceleration to support display and gaming effects • Camera image signal processor (ISP2P) that supports multiple formats and interfacing options to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Connectivity to various cellular modem chipset • Memory stacking feature using the package-on-package (POP) implementation (see Section 1.4, Package-on-Package Concept) ...展开收缩
(系统自动生成,下载前可以参看下载内容)
下载文件列表
相关说明
- 本站资源为会员上传分享交流与学习,如有侵犯您的权益,请联系我们删除.
- 本站是交换下载平台，提供交流渠道，下载内容来自于网络，除下载问题外，其它问题请自行百度。
- 本站已设置防盗链，请勿用迅雷、QQ旋风等多线程下载软件下载资源，下载后用WinRAR最新版进行解压.
- 如果您发现内容无法下载，请稍后再次尝试；或者到消费记录里找到下载记录反馈给我们.
- 下载后发现下载的内容跟说明不相乎，请到消费记录里找到下载记录反馈给我们，经确认后退回积分.
- 如下载前有疑问，可以通过点击"提供者"的名字，查看对方的联系方式，联系对方咨询.
