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详细说明： The field of microelectromechanical systems (MEMS), particularly micromachined mechanical transducers, has been expanding over recent years, and the production costs of these devices continue to fall. Using materials, fabrication processes, and design tools orig inally developed for the microelectronic circuits industry, new types of microengineered device are evolving all the time—many offering numerous advantages over their traditional counterparts. The electrical properties of silicon have been well understood for many years, but it is the mechanical properties that have been exploited in many examples of MEMS. This book may seem slightly unusual in that it has four editors. However, since we all work together in this field within the School of Electronics and Computer Science at the University of Southampton, it seemed natural to work together on a project like this. MEMS are now appearing as part of the syllabus for both undergraduate and postgraduate courses at many universities, and we hope that this book will complement the teaching that is taking place in this area. The prime objective of this book is to give an overview of MEMS mechanical transducers. In order to achieve this, we provide some background information on the various fabrication techniques and materials that can be used to make such devices. The costs associated with the fabrication of MEMS can be very expensive, and it is therefore essential to ensure a successful outcome from any specific production or development run. Of course, this cannot be guaranteed, but through the use of appropriate design tools and commercial simulation packages, the chances of failure can be minimized. Packaging is an area that is sometimes overlooked in textbooks on MEMS, and we therefore chose to provide coverage of some of the methods used to provide the interface between the device and the outside world. The book also provides a background to some of the basic principles associated with micromachined mechanical transducers. The majority of the text, however, is dedicated to specific examples of commercial and research devices, in addition to discussing future possibilities. Chapter 1 provides an introduction to MEMS and defines some of the commonly used terms. It also discusses why silicon has become one of the key materials for use in miniature mechanical transducers. Chapter 2 commences with a brief discussion of silicon and other materials that are commonly used in MEMS. It then goes on to describe many of the fabrication techniques and processes that are employed to realize microengineered devices. Chapter 3 reviews some of the commercial design tools and simulation packages that are widely used by us and other researchers/designers in this field. Please note that it is not our intention to provide critical review here, but merely to indicate the various features and functionality ix offered by a selection of packages. Chapter 4 describes some of the techniques and structures that can be used to package micromachined mechanical sensors. It also discusses ways to minimize unwanted interactions between the device and its packaging. Chapter 5 presents some of the fundamental principles of mechanical transduction. This chapter is largely intended for readers who might not have a background in mechanical engineering. The remaining four chapters of the book are dedicated to describing specific mechanical microengineered devices including pressure sensors (Chapter 6), force and torque sensors (Chapter 7), inertial sensors (Chapter 8), and flow sensors (Chapter 9). These devices use many of the principles and techniques described in the earlier stages of the book. ...展开收缩
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