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安森美半导体ESD保护器件NUP3115UPMU-D 数据手册.pdf
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详细说明:安森美半导体ESD保护器件NUP3115UPMU-D 数据手册pdf,安森美半导体ESD保护器件NUP3115UPMU-D 数据手册NUP3115UPMU
IEC 61000-4-2 Spec
lEC61000-4-2 Waveform
Test
First Peak
Voltage Current Current at Current at
100
Level (kv)
(A)
30ns()|60ns(4)
9o%
7.5
2
4
15
8
i o ns
3
22.5
12
6
4
8
0
16
8
I 60 ns
10%
tp=0.7 ns to 1 ns
Figure 3. IEC61000-4-2 Spec
ESD Gun
TVS
Oscilloscope
50g
□口口
Cable
50g
O吕O
OOO
○O
Figure 4. Diagram of ESD Test Setup
The following is taken from Application Note
systems such as cell phones or laptop computers it is not
AND8308/D-Interpretation of Datasheet Parameters
clearly defined in the spec how to specify a clamping voltage
for esd devices
at the device levcl. ON Semiconductor has developed a way
ESD Voltage Clamping
to examine the entire voltage waveform across the ESd
For sensitive circuit elements it is important to limit the
protection diode over the time domain of an ESd pulse in the
voltage that an ic will be exposed to during an esd event
form of an oscilloscope screenshot which can be found on
to as low a voltage as possible. The esd clamping voltage
the datasheets for all ESd protection diodes. For more
is the voltage drop across the ESD protection diode during
information on how on Semiconductor creates these
an esd event per the Iec61000-4-2 waveform Since the
screenshots and how to interpret them please refer to
IEC61000-4-2 was written as a pass/fail spcc for largcr
AND8307/D
100
PEAK VALUE IRSM 8 us
90
山80
PULSE WIDTH() IS DEFINED
AS THAT POINT WHERE THE
70
PEAK CURRENT DECAY=8 us
60
H
HALF VALUE RSM/2 20 us
50
n
n30
520
10
0
60
t, TIME(us)
Figure 5. 8 X 20 us Pulse Waveform
http:/onsemi.com
NUP3115UPMU
PACKAGE DIMENSIONS
UDFN6.1.6X1.6,0.5P
CASE 517AP-0
SSUE O
NOTES
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M. 1994
a 0.10 C
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION D APPLIEs TO PLAtED tErmin
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PIN ONE
DETAILA
PAD AS WELL AS THE TERMINALS
REFERENCE
OPTIONAL
MILLIMETERS
CONSTRUCTION
DIM MINMAX
A0450.55
010C
EXPOSED CU
MOLD CMPD
A10.000.05
LA30.13 REF
TOP VIEW
D 1.60BSC
A
A3
E 1.60 BSc
DETAIL B
0.05C
D2|1.101.30
E20450.65
L台d!
DETAIL B
0.20
40
0.05c
OPTIONAL
CONSTRUCTION
10000.15
SIDE VIEW
SEATING
A1
PLANE
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
DETAIL A
D2
,12
6X
0.52
6x b
eH
0.10C AB
BOTTOM VIEW
0.05C NOTE 3
0.50 PITCH-
0.32
DIMENSIONS: MILLIMETERS
FFor additional information on our Pb-Free strategy and soldering
details, please download the on semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D
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