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文件名称: 安森美半导体ESD保护器件MMBZ27VAW-D 数据手册.pdf
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 详细说明:安森美半导体ESD保护器件MMBZ27VAW-D 数据手册pdf,安森美半导体ESD保护器件MMBZ27VAW-D 数据手册MMBZ27VAWT1G TYPICAL CHARACTERISTICS 18 1000 15 之 0. 0 0.01 0 +100 +150 40 TEMPERATURE(°o) TEMPERATURE ( C) Figure 1. Typical Breakdown Voltage Figure 2. Typical Leakage Current versus Temperature versus Temperature (Upper curve for each voltage is bidirectional mode lower curve is unidirectional mode) 320 300 280 ∈250 240 乙 ALUMINA SUBSTRATE 200 56V E160 v150 120 15V 100 680 FR-5 BOARD 0 0 001251501 BIAS (V) TEMPERATURE(°C Figure 3. Typical Capacitance versus Bias Voltage Figure 4. Steady State Power Derating Curve h voltage is unidirectional mod lower curve is bidirectional mode http://onsemi 3 MMBZ27VAWT1G TYPICAL CHARACTERISTICS PULSE WIDTH (tP)IS DEFINED tr≤10us AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 山LO 90 100 50%OF Ipp PEAK VALUE-lPp z 60 HALF VALUE zu3O 50 930 tp 缶20 10 0255075100125150175200 t, TIME (ms) A, AMBIENT TEMPERATURE C) Figure 5. Pulse Waveform Figure 6. Pulse Derating Curve MMBZ27VAWT1 MMBZ27VAWT1 100 100 RECTANGULAR RECTANGULAR WAVEFORM, TA=25'C SrusoLuor20xu BIDIRECTIONAL Eruonu WAVEFORM, TA=25C BIDIRECTIONAL E UNIDIRECTIONAL 正10 UNIDIRECTIONAL □ r 0.1 100 0.1 1000 PW, PULSE WIDTH (ms) PW, PULSE WIDTH (ms) Figure 7. Maximum Non-repetitive Surge Figure 8. Maximum Non-repetitive Surge Power, Ppk versus PW Power, Ppk(NOM) versus PW Power is defined as VRsm X lz(pk) where Vesm is Power is defined as Vz(NOM)x lz(pk) where the clamping voltage at lz(pk) VzNOM)is the nominal Zener voltage measured at the low test current used for voltage classification http://onsemi.co MMBZ27VAWT1G PACKAGE DIMENSIONS sc-70(SOT-323) CASE419-04 SSUE M D 1. DIMENSIONING AND TOLERANCING PER ANSI 2, CONTROLLING DIMENSION: INCH E MILLIMETERS INCHES DIM MIN NOM MAX MIN NOMMAX A0800.901.0000320.0350.040 A1000005010000000020004 0.7 REF 0028R 0.012 c010018025000400070.010 802.10 0.071 87 151.241.3500450.0490.053 0510.055 V 0.65 BSC 026 BSC 0.425RE 0.017REF A2 c[HE20021024000790.030.095 STYLE 4 ⌒0.05002 PIN 1. CATHODE A1 2. CATHODE 3. ANODE SOLDERING FOOTPRINT* 0.65 0.65 0.025 0.025 19 0.075 0.9 0.035 0.7 0.028 SCAI *For additional information on our Pb-Free strategy and soldering details, please download the oN Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ON Semiconductor and (n aro registered trademarks of Semiconductor Compononts Industries, LLC (SCILLC). SCILLC reserves the right to make changos without further notico to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Al operating parameters, including "Typicals" must be validated for each customer applicatian by customer's technical experts. SCILLC does not convey any license under its patent ngts nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant in o the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLc oroduct could create a situation where personal injury or death may occur. Should Buyer purchase or use SCiLLC products for any such unintended or unauthorized application, Buyer shall indemnify anc hold Scillc and its officers, employees, subsidiaries, affiliates and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT N.AmericanTechnicalSupport800-282-9855TollFreeOnSemiconductorWebsitewww.onseml.com Literature Distribution Center for oN Semiconductor USA/Canada PO. Box 5163. Denver Colorado 80217 USA Europe, Middle East and Africa Technical Support: OrderLiterature:http://www.onsemi.com/orderlit Phone: 303-675-2175 or 800-344-3860 Toll Free USA Canada Phone: 421 33790 2910 Fax: 303-675-2176 or B00-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email:orderlitonsemi.com Phone:81-3-5773-3850 Sales Representative MMBZ27VAW/D
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