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安森美半导体ESD保护器件MMBZ27VAW-D 数据手册.pdf
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详细说明:安森美半导体ESD保护器件MMBZ27VAW-D 数据手册pdf,安森美半导体ESD保护器件MMBZ27VAW-D 数据手册MMBZ27VAWT1G
TYPICAL CHARACTERISTICS
18
1000
15
之
0.
0
0.01
0
+100
+150
40
TEMPERATURE(°o)
TEMPERATURE ( C)
Figure 1. Typical Breakdown Voltage
Figure 2. Typical Leakage Current
versus Temperature
versus Temperature
(Upper curve for each voltage is bidirectional mode
lower curve is unidirectional mode)
320
300
280
∈250
240
乙
ALUMINA SUBSTRATE
200
56V
E160
v150
120
15V
100
680
FR-5 BOARD
0
0
001251501
BIAS (V)
TEMPERATURE(°C
Figure 3. Typical Capacitance versus Bias Voltage
Figure 4. Steady State Power Derating Curve
h voltage is unidirectional mod
lower curve is bidirectional mode
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3
MMBZ27VAWT1G
TYPICAL CHARACTERISTICS
PULSE WIDTH (tP)IS DEFINED
tr≤10us
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
山LO
90
100
50%OF Ipp
PEAK VALUE-lPp
z
60
HALF VALUE
zu3O
50
930
tp
缶20
10
0255075100125150175200
t, TIME (ms)
A, AMBIENT TEMPERATURE C)
Figure 5. Pulse Waveform
Figure 6. Pulse Derating Curve
MMBZ27VAWT1
MMBZ27VAWT1
100
100
RECTANGULAR
RECTANGULAR
WAVEFORM, TA=25'C
SrusoLuor20xu
BIDIRECTIONAL
Eruonu
WAVEFORM, TA=25C
BIDIRECTIONAL
E UNIDIRECTIONAL
正10
UNIDIRECTIONAL
□
r
0.1
100
0.1
1000
PW, PULSE WIDTH (ms)
PW, PULSE WIDTH (ms)
Figure 7. Maximum Non-repetitive Surge
Figure 8. Maximum Non-repetitive Surge
Power, Ppk versus PW
Power, Ppk(NOM) versus PW
Power is defined as VRsm X lz(pk) where Vesm is
Power is defined as Vz(NOM)x lz(pk) where
the clamping voltage at lz(pk)
VzNOM)is the nominal Zener voltage measured at
the low test current used for voltage classification
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MMBZ27VAWT1G
PACKAGE DIMENSIONS
sc-70(SOT-323)
CASE419-04
SSUE M
D
1. DIMENSIONING AND TOLERANCING PER ANSI
2, CONTROLLING DIMENSION: INCH
E
MILLIMETERS
INCHES
DIM MIN
NOM MAX MIN NOMMAX
A0800.901.0000320.0350.040
A1000005010000000020004
0.7 REF
0028R
0.012
c010018025000400070.010
802.10
0.071
87
151.241.3500450.0490.053
0510.055
V
0.65 BSC
026 BSC
0.425RE
0.017REF
A2
c[HE20021024000790.030.095
STYLE 4
⌒0.05002
PIN 1. CATHODE
A1
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.65
0.65
0.025
0.025
19
0.075
0.9
0.035
0.7
0.028
SCAI
*For additional information on our Pb-Free strategy and soldering
details, please download the oN Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D
ON Semiconductor and (n aro registered trademarks of Semiconductor Compononts Industries, LLC (SCILLC). SCILLC reserves the right to make changos without further notico
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Al
operating parameters, including "Typicals" must be validated for each customer applicatian by customer's technical experts. SCILLC does not convey any license under its patent ngts
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LITERATURE FULFILLMENT
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MMBZ27VAW/D
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