HMC5983数据手册.pdfHMC5983数据手册HMC5983 Characteristics

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详细说明：HMC5983数据手册HMC5983 Characteristics Conditions" Min Typ Max Units General ESD Voltage Human Body Model (all pins) 2000 Volts Charged Device Model (all pins) 750 L Operating Temperature Ambient 30 85 Storage Temperature Ambient, unbiased 40 125 Reflow Classification MSL 3, 260C Peak Temperature Package Size Length and width 2.85 3.00 3.15 mm Package Height n 0.9 10 mm Package Weight 18 mg Absolute Maximum Ratings ( Tested at 25C except stated otherwise. Characteristics Min Max Units Supply Voltage VDD 0.3 4.8 Volts Supply Voltage VDDIO 0.3 4.8 Volts Reflow Classification MSL 3, 260 oC Peak Temperature PIN CONFIGURATIONS Table 1: Pin Configurations Pin Name Description SCUSPI_SCK Serial Clock -I2C Master/Slave Clock or SPI Serial Clock VDD Power Supply(2. 16V to 3.6V) 3 NC Not to be connected 4 SPI CS Chip Select line for SPl (active low). Tie to VDDlO for 12C Interface SPI SDO SPI Serial Data Out 6 12C /-SPl 2C /SPI selection pin. Connect to VDD for 12C(Also connect SPl CS to VDDIO) Connect to gND for SPl 7 NC Not to be connected 8 SETP Set/Reset Strap Positive-S/R Capacitor(C2)Connection Start of Conversion (leading edge active) connect to ground when this 9 Soc function/pad is not used in application 10 C1 Reservoir Capacitor(C1)Connection GND Supply ground 12 SETC S/R Capacitor(C2)Connection -Driver Side 13 VDDIO IO Power Supply(1.71V to VDD 14 NC Not to be connected no internal connection 15 DRDY Data Ready, Interrupt Pin. Internally pulled high. Optional connection. Low for >200 usec when data are placed in the data output registers 16 SDA/SPI SDI Serial Data-2C Master/Slave Data or sPl Serial Data In or sPl serial Data v/o (sDl/O)for 3-wire interface ww.honeywell.com HMC5983 SCL/SPL_SCK 12 SETC VDD 2 1GND NC 10C X SPI_CS(S1)4 9 SoC TOP VIEW( Looking Through) Arrow indicates direction of magnetic field that generates a positive output reading in Normal Measurement configuration PACKAGE OUTLINES PACKAGE DRAWING HMC5983(16-PIN LPCC, dim ensions in millim eters) fo.50 6x PIN 1 NARKER 0.325X0.25016X 506X 3.00 0.625 0.625 0.90 3.00 SIDE VIEW BOTTOM VIEW (Dimensions in mm) ww.honeywell.com HMC5983 MOUNTING CONSIDERATIONS The following is the recommend printed circuit board(PCB) footprint for the HMC5983 1275 1276 030 3.000 050x12 0.100x8 3000 HIC5983 Land Pad Pattern (AI dimensionsare in mm) LAYOUT C。Ns| DERATIONS Besides keeping all components that may contain ferrous materials(nickel, etc. ) away from the sensor on both sides of the PCB, it is also recommended that there is no conducting copper under/near the sensor in any of the PCB layers. See recommended layout below 12C Layout Examples: Notice that the one trace under the sensor in the dual supply mode is not expected to carry active current since it is for pin 4 pull-up to VDDIO. Power and ground planes are removed under the sensor to minimize possible source of magnetic noise. For best results, use non-ferrous materials for all exposed copper coding w. honeywell. com HMC5983 4 UDD Oc VDD/VDDIO HMC5983 HMC5983 Dual Supply Single Supply Layout examples are for dual supply and single supply) modes only PCB Pad Definition and Traces The HMC5983 is a fine pitch LCC package. Refer to previous figure for recommended PCB footprint for proper package centering. Size the traces between the HMC5983 and the external capacitors(C1 and C2)to handle the 1 ampere peak current pulses with low voltage drop on the traces Stencil Design and solder Paste A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads Reflow Assembly This device is classified as MSL 3 with 260 C peak reflow temperature As specified by JEDEC, parts with an MSL 3 rating require baking prior to soldering if the part is not kept in a continuously dry(<10% RH)environment before assembly. Refer to Table 4-1 Reference Conditions for Drying Mounted or Unmounted SMD Packages" in the IPC/JEDEC standard J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices for additional information. No special reflow profile is required for HMC5983, which is compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends adherence to solder paste manufacturers guidelines. Hand soldering is not recommended. Built-in self test can be used to verify device functionalities after assembly External Capacitors The two external capacitors should be ceramic type construction with low ESR characteristics. The exact ESR values are not critical but values less than 200 milli-ohms are recommended. Reservoir capacitor C1 is nominally 4.7 uF in capacitance, with the set/reset capacitor C2 nominally 0.22 HF in capacitance. Low ESR characteristics may not be in many small SMT ceramic capacitors(0402), so be prepared to up-size the capacitors to gain Low ESR characteristics ww.honeywell.com HMC5983 INTERNAL SCHEMATIC DIAGRAM HMC5983 HMC5983 HOST CPU [OPT) 16 SDA/SPI_SDI 2C DATA -LIP CL/SPlSCH 2C CLK SPI SDO ANALOG CONTROL 22k2.2k AMP 12C/SPl OFF SET STRAP 9k2v0 21vto3.6 ALIP D RIVER 9 Soc 1GND 0.1 VDDIO VDD 71V tO VDD SET/RESET STR AP aRE日 DRIVER 0.1uf C1 4.7uf 8 SETP SETC 55 C2 I2C SLAVE 12C MASTER 022u External connections are shown as an example for 12C with dual supplies ww.honeywell.com HMC5983 DUAL SUPPLY REFERENCE DESIGN(IC) HMC5983 HOST CPU 2.16Vt03.6V VDD 2 12C/SPI b 0.1uf 1.71V tO VDD VDDIO 1 VDD SPI CS4 22K3322k SCL/SPL_SCKA1 12C CLK SDA/SPI SDI16 12C DATA SETPH8 C2 SETCA12 022uf 10 0.1uf C1 C1 4.7μf oc 9 GND 11 ySs I2C SLAVE 12C MASTER SINGLE SUPPLY REFERENCE DESIGN(IC HMC5983 HOST CPU VDD 12C/SPI 2.16vto3.6v VDDIO VDD SPI CS4 22K〈〈2.2k SCL/SPI SCK人1 12C CLK SDA/SPI SD/A16 12C DATA SETP 8 C2 SETC A12TI 022uf 0.1uf C1 4.7uf Soc GND 11 12C SLAVE 2C MASTER ww.honeywell.com HMC5983 DUAL SUPPLY REFERENCE DESIGN (SPI) HMC5983 HOST CPU 2,16Vt03.6V VDD 1C4 0.1 1.71V to VDD VDD SCL/SPL_/ SCK SDA/SPI SDI/1B MOSI SPL_SD0A5 MISO SETP 8 SETCA12 022uf 0.1uf C1 C1 1C6÷47 Soc GND 11 VSS SPI SLAVE SPI MASTER SINGLE SUPPLY REFERENCE DESIGN (SPI) HMC5983 HOST CPU VDD 2.16to3.6v VDDIO H3 SPI CS SCL/SPI SCKA1 SCK SDA/SPL_SDI16 MOSI SETPH8 SETC 12 022uf C10 0. 1 uf +C1 4.7uf 2CS7/6 SoC GNDA11 VSS SPI SLAVE SPI MASTER w. honeywell. com HMC5983 PERFORMANCE The following graph(s) highlight HMC5983's performance Typical Noise Floor(Field Resolution HMC5983 Resolution HMC5983 Resolution 3.5 25 a25 15 1 Avg 2A冒 1.5 m 4 Avg 4 Ave 0.5 gAv冒 8≥,5 0.5 sAvE Gain BASIC DEVICE OPERATION Anisotropic Magneto-Resistive Sensors The Honeywell HMC5983 magnetoresistive sensor circuit is a trio of sensors and application specific support circuits to measure magnetic fields With power supply applied the sensor converts any incident magnetic field in the sensitive axis directions to a differential voltage output. The magnetoresistive sensors are made of a nickel-iron(Permalloy) thin-film and patterned as a resistive strip element In the presence of a magnetic field, a change in the bridge resistive elements causes a corresponding change in voltage across the bridge outputs These resistive elements are aligned together to have a common sensitive axis(indicated by arrows in the pinout diagram) that will provide positive voltage change with magnetic fields increasing in the sensitive direction. Because the output is only proportional to the magnetic field component along its axis, additional sensor bridges are placed at orthogonal directions to permit accurate measurement of magnetic field in any orientation Self Test To check the HMC5983 for proper operation, a self test feature is incorporated in which the sensor is internally excited with a nominal magnetic field(in either positive or negative bias configuration). This field is then measured and reported This function is enabled and the polarity is set by bits MS[n] in the configuration register A. An internal current source generates a DC current(about 10 mA)from the VDD supply. This DC current is applied to the offset straps of the magneto-resistive sensor, which creates an artificial magnetic field on the sensor. The difference of this measurement and the measurement of the ambient field will be put in the data output register for each of the three axes By using this built-in function, the manufacturer can quickly verify the sensor's full functionality after the assembly without additional test setup. The self test results can also be used to estimate/compensate the sensors sensitivity drift due to temperature For each self test measurement the asic 1. Sends a Set pulse 2. Takes one measurement(M1) 3. Sends the (-10 mA)offset current to generate the (-1.1 Gauss)offset field and takes another measurement(M2) 4. Puts the difference of the two measurements in sensor's data output register Output= [M2-M1](i.e. output offset field only See SELF TEST OPERATION section later in this datasheet for additional details w.honeywell.com

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