高速PCB设计指南之二_258222.pdf高速PCB设计指南之二_258222PCB (3,4 6

文件名称: 高速PCB设计指南之二_258222.pdf

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上传时间: 2019-09-04

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详细说明：高速PCB设计指南之二_258222PCB (3,4 6 (:mm) 0.20.20.2 0.80.60.4 0.10.050.0 50.80.2 0.5 0.05 (MELF)( Imm 1.00.40.2 0.20.⊥0.0 0.20.10.0 0.20.250.25 0.5 0.05 0.05 mm 0.20.10 0.20.10 0.20.10 0.250.10.05 0.5 0.05 0.05 L mm) 3 PCB 0.10.10.0 1.00.50.2 0.10.10.1 0.50.250.05 0 0.05 BGA BGA BGA 0.50,0.600.80mm。BGA BGA I C BGA (I/O) BGA COB( chip-on-board)( BGA J 5 B iA,了 EDEC M 28 BGA 1.27mm。。 JEDEC MO BGA。 7.0-50.0 50,1,271,00m I C J EDEC BGA 。 Fdic O MO一195 0.50m1m 4.0-21.0mm, 20mm。 C 0 m B) 0.50mm JEDEC 0.25、 nn 4 PCB BGA 0,25mm 0.08 03 I/O (via-on-pa d) (i n t e r pose r) LBGA HBGA bGA PCB 。以BGA C B BG A I PC-SM--782 14,0 BGA 0.073mm BGA B BGA BGA I/O BGA PCB 0.050.250.300.350.250.30 0.650.250.300.350.25-0.30 0.650.350.400.450.35-0.40 0.800.250.300.350.250.30 0.800.350.400.450.35-0.40 0.800.450.500.550.40-0.50 1.000.550.600.650.50-0.60 1270.700.750.800.60-0.70 1.500.700.750.800.600.70 BGA 0 mr I BG A .50m BGA 0,00 BGA (SMD) SMD FP、 TSOP I/O BGA 1.0mm(0.040") PCB PCB 195°C (SMOBC, soldermask over bare copper) SMO PCB Q P TABOt a b lca t om a ted bon d) 0,23mm 700-800 TAB HASLChot air solder level g sQFP、 TSOP BGA IPC-2221 -5.0um( 3um), 0.08-0.23um 0.8m(3μ"), Ni/Au (Benzotriazole ENTEK PLUS CU 106A SMD PCB ni,A PCB BGA PCB HASL PCB SQFPμBGA HASL PCB BGA PCB 4mm(0.0015") PCB 07-0,10mm(0.003-0.0 5mm(0.00 0.07n (0.003 (fine- p i t ch)、 BGA CSP BG A BGA B PCB BGA (c h i p e PCB (3 L/O IC (4) IMP809, IMP706, IMP813 X25043,X25045, (5 6)IC 10~100uF 100uF 0. OluF 4~10 1~10uF 500kHz 20MHz (0.5uA ROM、RAM cc) (GND) 9 PCB PCB PCB PCB IC )、 PCB d 》2000 PCB EMC CaD pcB PCB PCB ,S-VCC、S- VEE VEE-VCO 。MOS IOL-IOH TTL IOLAIOH ZO(9) )<<10 ECL 100 HOOT 200 ZO Cdec

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