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商城的6*2.7小咪头质量太差了-SPU0410HR5H-PB.pdf
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详细说明:商城的6*2.7小咪头质量太差了-SPU0410HR5H-PB.pdfKNOWLES
SPUO410HR5H-PB
ACOUS
4. AcoustiC electricAl sPecifications
Limits
sv
ymbo
Condition
Unit
Nom。
Max
Directivity
Omni-directional
Sensitivity
S
1kHz(OdB=1V/Pa)
-45
42
39
d B
Output impedance
Z
OUT
1kHz(OdB=1V/Pa)
400
Current Consumption
DSS
across 1.5 to3.6 volts
250
IA
Signal to Noise Ratio
S/N
1kHz(OdB=1V/Pa)
59
d B
Supply voltage
Vs
1.5
3.6
Sensitivity loss across
Change in sensitivity over No Change Across Voltage
Voltage
3.6vto1.5V
d B
Range
At 100dB SPL, THD<1%
THD
d B
At 115dB SPL, THD< 10%
5. FREQUENCY RESPONSE CURVE
15
10
FF-10
5
56789
456789
1000
FREQUENCY N HERTZ
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6. MECHANICAL SPECIFICATIONS
700
H
1.475
0.650
(2X
2.460
0.800
3.357REF
(2X)
4X)
0.254
2.622REF
R0.279
RE
ITEM MENSIONTOLERANCEUNITS
HEIGHT (HI
N OUPUT
士0,0
PIN FUNCTION
LENGTH (LI
WIDTH (W)
2.950
IPOWER (vdd
ACOUSTIC
GROUND
PORT ( AP
p0.500
土0.|0
m n
GROUND
QUTPUT
NOTES
I DIMENS ONS N MILL IMETERS UNLESS
THERWISE SPEC IFIED
2. ToLeRaNCE +0.1 5mm UNLESS OTHERWISE SPEC IFIED
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7. RECOMMENDED CUSTOMER LAND PATTERN
700
【2X)
p0.800
(4X)
2.460
2X)
8. RECOMMENDED SOLDER STENCIL PATTERN
N/A
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9. RECOMMENDED INTERFACE CIRCUIT
TERM
R
DOTTED
R2
SECTION
REPRESENTS
TERM 4
MICROPHONE
TERM. 2
EXTERNAL GAIN (SET BY
TERM. 3
CUS TOMER)=RI/R2
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10. PACKAGING DETAIL
ITEM DIMENSION
Mw【INCH】
3.40
±0.|0
--十-台十田-
A-
30
±0.|0
4.00
+0.20
属回画
OVER IO HOLES
2.50
12.00
士0.30
5.50
士0.05
75
+0.|0
士0.05
TRACK ING NUMBER CONVENTION
MODEL NUMBER SUFFIX
REEL
QUANT ITY
A.50
↓0.l0j0
X- MANUFACTURING LOCATION
D PER REEL
D15040.10/-0
KAL PHA CHARACTER
SPUO4 10HR 5H-PB
1,200
JOB I DENTIFICAT
士0.05
NUMBER(J|N〕
sU4R98713:5,100
NUMERIC CHARACTER
IANUFACTURING LOCATION
TaPe REEL\PER EIA-481
E ENGINEERING SAMPLES
LABEL
LABEL APPLIED TO EXTERNAL PACAGE AND
DIRECT TO REEL
PIN H
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11 SOLDER REFLOW PROFILE
260C
230
170-180°C
Pre-heat
Solder melt
120 sec
sec
Stage
Temperature Profile
Time/maximum)
Pre-heat
170~180C
120 sec
Solder melt
Above 230 C
100 sec
Peak
260C maximum
30 sec
Notes
Do not pull a vacuum over the port hole of the microphone. pulling a
vacuum over the port hole can damage the device
2
Do not board wash after the reflow process. board washing and cleaning
agents can damage the de
Do not expose to ultrasonic processing o
cleaning
3.
Number of reflow= recommend no more than 3 cycles
12. ADDITIONAL NOTES
(A) Shelf life: Twelve(12 )months when devices are to be stored in factory supplied, unopened ESD
moisture sensitive bag under maximum environmental conditions of 30], 70%R h
MSL (moisture sensitivity level)Class 2a
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13. RELIABILITY SPECIFICATIONS
Note: After test conditions are performed the sensitivity of the microphone shall not deviate
more than 3db from its initial value
Test
Description
Thermal shock
100 cycles of air-air thermal shock from -40C to +125C
th 15min soaks. (ICE 68-2-4)
High Temperature
+105C environment for 1,000 hours. (IEC 68-2-2 Test Ba)
Storage
LoW Temperature
40C environment for 1,000 hours. (IEC 68-2-2 Test Aa)
Storage
High Temperature Bias +105C environment while under bias for 1,000 hours.(IEC
68-2-2 Test Ba
Low Temperature Bias-40C environment while under bias for 1, 000 hours. (IEC
68-2-2 Test Aa)
Temperature/
+85C/85%Rh environment while under bias for 500
Humidity bias
hours. JESD22-A101A-B)
Vibration
4 cycles lasting 12 minutes from 20 to 2, 000Hz in X, Y, and
Z direction with a peak acceleration of 20g ( MIL 883E
Method 2007. 2, A)
Electrostatic Discharge 3 discharges at +/-8kv direct contact to the lid when unit
is grounded(IEC 61000-4-2 )and 3 discharges at+/-2kv
direct contact to the l/o pins(MIl 883E, Method 3015.7)
Reflow
5 reflow cycles with peak temperature of 260C
Mechanical shock
3 pulses of 10, 000g in the X, Y, and Z direction. (IEC 68-2
27, Test Ea)
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14. SPECIFICATION REVISIONS
Revision
Detailed Specification Changes
Date
X1
Preliminary Specification Release
06-24-2008
A
Specification release
02-17-2009
Typographical error corrected; output impedance value 400ohms
(B)
03-31-2009
The information contained in this literature is based on our experience to date and is believed to be reliable and it is subject to change
without notice. It is intended as a guide for use by persons having technical skill at their own discretion and risk. We do not guarantee
favorable results or assume any liability in connection with its use. Dimensions contained herein are for reference purposes only For
specific dimensional requirements consult factory. This publication is not to be taken as a license to operate under, or recommendation to
infringe any existing patents. This supersedes and voids all previous literature
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