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STM32L071RBT6 M0 低功耗，5Uart,128KB Flash, 20KB，适合跑操作系统。-STM32L071RBT6.pdf
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详细说明：STM32L071RBT6 M0 低功耗，5Uart,128KB Flash, 20KB，适合跑操作系统。-STM32L071RBT6.pdfSTM32L071xX
Contents
3.15.12Cbus
30
3.15.2 Universal synchronous/asynchronous receiver transmitter(USART).3
3.15.3 Low-power universal asynchronous receiver transmitter(LPUART). 31
3.15.4 Serial peripheral interface(SPI)Inter-integrated sound(12S)
32
3.16 Cyclic redundancy check(CRC)calculation unit
32
3.17 Serial wire debug port (SW-DP)
32
Pin descriptions.∴
33
5
Memory mapping
52
Electrical characteristics
■
53
6.1 Parameter conditions
53
6.1.1
Minimum and maximum values
...53
6.1.2 Typical values
6.1.3 Typical curves
6.1.4 Loading capacitor
6.1.5 Pin input voltage
53
6. 1.6 Power supply scheme
54
6.1.7 Current consumption measurement
54
6.2 Absolute maximum ratings
6.3 Operating conditions
57
6.3.1 General operating conditions
.,,,,57
6.3.2 Embedded reset and power control block characteristics
.59
6.3.3 Embedded internal reference voltage
60
6.3.4 Supply current characteristics
6
6.3.5 Wakeup time from low-power mode
6.3.6 External clock source characteristics
75
6.3.7 Internal clock source characteristics
79
6.3. 8 PLL characteristics
.82
6.3.9 Memory characteristics
.82
6.3.10 EMC characteristics
..83
6.3. 11 Electrical sensitivity characteristics
..,,,.86
6.3.12 0 current injection characteristics
.,,,.,87
6.3.13 O port characteristics
88
6.3. 14 NRST pin characteristics
92
6.3.15 12-bit adc characteristics
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Contents
STM32L071XX
6.3.16 Temperature sensor characteristics
98
6.3.17 Comparators
..99
6.3.18 Timer characteristics
100
6.3.19 Communications interfaces
100
Package information.......,............108
7.1 LQFP100 package information
108
7.2 UFBGA100 package information
111
7.3 LQFP64 package information
113
7. 4 TFBGA64 package information
...,,,,116
7.5 WLCSP49 package information
,,,,,,119
7.6 LQFP48 package information
122
7.7 LQFP32 package information
125
7.8 UFQFPN32 package information
128
7 9 Thermal characteristics
131
7 9.1 Reference document
132
Part numbering......,..,,.
DD_■
,,,133
Revision history ..,.
134
4/136
Doc 101 ReV 3
STM32L071xX
List of tables
List of tables
Table 1
Device summary
Table 2. Ultra-low-power STM32L071xx device features and peripheral counts
Table 3. Functionalities depending on the operating power supply range
15
Table 4. CPU frequency range depending on dynamic voltage scaling
16
Table 5. Functionalities depending on the working mode
from Run/active down to standby)
16
Table 6
STM32LOXX peripherals interconnect matrix
....18
Table 7. Temperature sensor calibration values
Table 8
nternal voltage reference measured values
27
Table 9
Timer feature comparison
28
Table 10. Comparison of 12c analog and digital filters
30
Table 11. STM32L071xx I-C implementation
Table 12. USART implementation
.31
Table 13. SP1/12S implementation
...32
Table 14. Legend/abbreviations used in the pinout table
..38
Table 15. STM32L071XXX pin definition
.39
Table 16. Alternate functions port A
..46
Table 17. Alternate functions port B
Table 18. Alternate functions port C
48
Table 19. Alternate functions port D
.49
Table 20. Alternate functions port E
国面
50
Table 21. Alternate functions port H
Table 22. Voltage characteristics
55
Table 23. Current characteristics
Table 24. Thermal characteristics
56
Table 25. General operating conditions
.57
Table 26. Embedded reset and power control block characteristics
.59
Table 27. Embedded internal reference voltage calibration values
..60
Table 28. Embedded internal reference voltage
60
Table 29. Current consumption in Run mode, code with data processing running from
Flash memory
62
T able 30. Current consumption in Run mode vs code type
code with data processing running trom Flash memory
.....62
Table 31. Current consumption in Run mode, code with data processing running from RAM... 64
Table 32. Current consumption in Run mode vs code type
code with data processing running from RAM
64
Table 33. Current consumption in Sleep mode
65
Table 34. Current consumption in Low-power run mode
..66
Table 35. Current consumption in Low-power sleep mode
Table 36. Typical and maximum current consumptions in Stop mode
..68
Table 37. Typical and maximum current consumptions in Standby mode
69
Table 38. Average current consumption during Wakeup
70
Table 39. Peripheral current consumption in Run or Sleep mode
Table 40. Peripheral current consumption in Stop and Standby mode
73
Table 41. Low-power mode wakeup timings
73
Table 42. High-speed external user clock characteristics
75
Table 43. Low-speed external user clock characteristics
Table 44. HSE oscillator characteristics
,,,,77
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List of tables
STM32L071XX
Table 45. LsE oscillator characteristics
....78
Table 46. 16 MHz Hs 16 oscillator characteristics
79
Table 47. lsi oscillator characteristics
80
Table 48. MSI oscillator characteristics
...80
Table 49, PLL characteristics
翻
82
Table 50. RAM and hardware registers
82
Table 51. Flash memory and data EEProM characteristics
82
Table 52. Flash memory and data EEPROM endurance and retention
Table 53. Ems characteristics
84
Table 54. EMI characteristics
85
Table 55
ESD absolute maximum ratings
..86
Table 56. electrical sensitivities
86
Table 57. l/o current injection susceptibility
..87
Table 58. /0 static characteristics
88
Table 59. Output voltage characteristics
90
Table 60. /o ac characteristics
翻国
Table 61. NRST pin characteristics
..92
Table 62. Adc characteristics
...93
Table 63. RAIN max for fADC=16 MHz
95
Table 64. ADC accuracy
95
Table 65. Temperature sensor calibration values
98
Table 66
emperature sensor characteristics
98
Table 67. Comparator 1 characteristics
99
Table 68. Comparator 2 characteristics
99
Table 69. tiMx characteristics
100
Table 70. 12C analog filter characteristics
101
Table 71. USaRT/lPuart characteristics
Table 72. SPI characteristics in voltage Range 1
102
Table 73. sPi characteristics in voltage range 2
103
Table 74. SPI characteristics in voltage Range 3
,104
Table 75. 2S characteristics
.106
Table 76. LQPF100-100-pin, 14 x 14 mm low-profile quad flat package
mechanical data
109
Table 77. UFBGA100-100-pin, 7 X 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data
111
Table 78. UFBGA100 recommended PCB design rules(0.5 mm pitch BGA)
112
Table 79. LQFP64-64-pin, 10 x 10 mm low-profile quad flat
package mechanical data
..,113
Table 80. TFBGA64-64-ball, 5x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
grid array package mechanical data
.116
Table 81. TFBGA64 recommended PCB design rules(0.5 mm pitch BGA)
117
Table 82. WLCSP49-49-pin, 3.294 x 3.258 mm, 0. 4 mm pitch wafer level chip scale
package mechanical data
,.120
Table 83. WLCSP49 recommended PCB design rules(0.4 mm pitch)
12
Table 84. LQFP48-48-pin, 7 X 7 mm low-profile quad flat package mechanical data
.123
Table 85. LQFP32-32-pin, 77 mm low-profile quad flat package mechanical data
126
Table 86. UFQFPN32-32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package mechanical data
Table 87. Thermal characteristics
131
Table 88. STM32L07 1 xx ordering information scheme
133
Table 89. Document revision history
134
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STM32L071xX
List of figures
List of figures
Figure 1. STM32L07 1 xx block diagram
12
Figure 2. Clock tree
Figure 3. STM32L071XX LQFP100 pinout -14 X 14 mr
.,,,,,33
Figure 4. STM32L071XX UFBGA100 ballout-7X mm
34
Figure5.STM32L071××LQFP64 pinout-10×10mm
.34
Figure6.STM32L071×× TFBGA64 ballout-5X5mm
,,35
Figure 7. STM32L071XX WLCSP49 ballout
36
Figure 8. STM32L071XX LQFP48 pinout -7X7 mm
.,37
Figure 9. STM32L071XX LQFP32 pinout
37
Figure 10. STM32L071XX UFQFPN32 pinout
38
Figure 11. Memory map
52
Figure 12. Pin loading conditions
53
Figure 13. Pin input voltage
Figure 14. Power supply scheme
54
Figure 15. Current consumption measurement scheme
,54
Figure 16. IDD VS VDD, at TA= 25/55/85/105C, Run mode, code running from
Flash memory, Range 2, HSE, 1WS
..63
Figure 17. IDD VS VDD, at TA= 25/55/85/105C, Run mode, code running from
Flash memory, Range 2, HSl16, 1Ws
Figure 18. DD VS VDD, at TA=25C, Low-power run mode, code running
from RAM, Range 3, MSI (Range 0)at 64 KHz, 0 WS
Figure 19. IDD VS VDD, at TA=25/55/85/105/125C, Stop mode with rtc enabled
and running on LSE Low drive
68
Figure 20. IDD VS VDD, at TA= 25/55/85/105/125C, Stop mode with RtC disabled
a! clocks o斤f
69
Figure 21. High-speed external clock source AC timing diagram
Figure 22. Low-speed external clock source AC timing diagram
75
Figure 23. HSE oScillator circuit diagram
Figure 24. Typical application with a 32 768 kHz crystal
78
Figure 25. HSl16 minimum and maximum value versus temperature
Figure 26. VIH/VIL versus VDD(CMOS/Os
89
Figure 27. VIH/IL versus VDD(TTL /Os)
89
Figure 28. /0 AC characteristics definition
92
Figure 29. Recommended NRST pin protection
93
Figure 30. Adc accuracy characteristics
96
Figure 31. Typical connection diagram using the ADC
Figure 32. Power supply and reference decoupling(VREF+ not connected to VDDA)
..97
Figure 33. Power supply and reference decoupling(VREF+ connected to VDDA
..98
Figure 34. SPI timing diagram -slave mode and CPHA=0
104
Figure 35. SPI timing diagram -slave mode and CPHA =11)
..105
Figure 36. SPI timing diagram-master mode(1)
..,105
Figure 37. s slave timing diagram(Philips protocol)
.,,107
Figure 38. 1s master timing diagram( Philips protocol) (1)
FIgure40.LQFP100-10pn,14×14 mm low-profile quad fla′" cage outl∴……107
Figure 39. LQFP100-100-pin, 14 x 14 mm low-profile quad flat pa
...108
recommended footprint
110
Figure 41. LQFP100 marking example(package top view)
Figure 42. UFBGA100-100-pin, 7x 7 mm, 0.50 mm pitch, ultra fine pitch ball
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List of figures
STM32L071XX
grid array package outline
Figure 43. UFBGA100-100-pin, 7 x7 mm, 0.50 mm pitch, ultra fine pitch bal
111
grid array package recommended footprint
Figure 44. LQFP64-64-pin, 10 x 10 mm low-profile quad flat package outling
....113
Figure 45. LQFP64-64-pin, 10 X 10 mm low-profile quad flat recommended footprint
114
Figure 46. LQFP64 marking example (package top view)
115
Figure 47. TFBGA64-64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball
grid array package outline
·
Figure 48. TFBGA64-64-ball,5 X 5 mm, 0.5 mm pitch, thin profile fine pitch bal
grid array recommended footprint
117
Figure 49. TFBGA64 marking example(package top view)
118
Figure 50. WLCSP49-49-pin, 3.294x 3.258 mm, 0.4 mm pitch wafer level chip scale
package outline
119
Figure 51. WLCSP49-49-pin, 3.294 x 3. 258 mm, 0. 4 mm pitch wafer level chip scale
recommended footprint
120
Figure 52. WLCSP49 marking example(package top view)
.,121
Figure 53. LQFP48-48-pin, 7 7 mm low-profile quad flat package outline
122
Figure 54. LQFP48-48-pin, 7 x 7 mm low-profile quad flat recommended footprint
..124
Figure 55. LQFP48 marking example (package top view)
124
Figure 56. LQFP32-32-pin, 77 mm low-profile quad flat package outline
125
Figure 57. LQFP32-32-pin, 7 X 7 mm low-profile quad flat recommended footprint
126
Figure
LQFP32 marking example(package top view)
Figure 59. UFQFPN32-32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
package outline
128
Figure 60. UFQFPN32-32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat
recommended footprint
129
Figure 61. UFQFPN32 marking example(package top view)
.130
Figure 62. Thermal resistance
132
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STM32L071xX
Introduction
Introduction
The ultra-low-power STM32L071xx are offered in 9 different package types from 32 pins to
100 pins. Depending on the device chosen, different sets of peripherals are included, the
description below gives an overview of the complete range of peripherals proposed in this
mIly.
These features make the ultra-low-power stM32L07 1 xx microcontrollers suitable for a wide
range of applications
Gas/water meters and industrial sensors
Healthcare and fitness equipment
Remote control and user interface
PC peripherals, gaming, GPS equipment
Alarm system, wired and wireless sensors, video intercom
This STM32L071xx datasheet should be read in conjunction with the STM32L0X1xX
reference manual (RM0377
For information on the ARM Cortex-MO+ core please refer to the Cortex -MO+ Technical
Referencemanualavailablefromthewww.arm.comwebsite
Figure 1 shows the general block diagram of the device family
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Description
STM32L071XX
2
Description
The access line ultra-low-power STM32L071xX microcontrollers incorporate the high
performance ARM Core -M0+ 32-bit RISC core operating at a 32 MHz frequency, a
memory protection unit(MPU), high-speed embedded memories(up to 192 Kbytes of Flash
program memory, 6 Kbytes of data EEPROM and 20 Kbytes of RAM) plus an extensive
range of enhanced l /Os and peripherals
The stM32L071 xx devices provide high power efficiency for a wide range of performance
It is achieved with a large choice of internal and external clock sources, an internal voltage
adaptation and several low-power modes
The sTM32L071 xx devices offer several analog features, one 12-bit ADC with hardware
oversampling, two ultra-low-power comparators, several timers, one low-power timer
(LPTIM), four general-purpose 16-bit timers and two basic timer, one RtC and one SysTick
hich can be used as timebase. They also feature two watchdogs, one watchdog with
interfaces: up to three 12Cs, two SPls, one 12S, four USARTs. a low-power UAR>Ock
independent clock and window capability and one window watchdog based on bus cl
Moreover the stm32L07 1 xx devices embed standard and advanced communicati
(LPUART)
The stM32L071 xx also include a real-time clock and a set of backup registers that remain
powered in Standby mode
The ultra-low-power STM32L071xX devices operate from a 1.8 to 3.6V power supply(down
to 1.65V at power down) with BOR and from a 1.65 to 3.6V power supply without BOR
option. They are available in the-40 to +125C temperature range. a comprehensive set of
power-saving modes allows the design of low-power applications
Cortex
Intelligent Processors by ARM
ARM
10/136
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