IEC60664-3-2016低压系统内设备的绝缘配合第3部分用于污染防护的涂层、封装或模塑的使用.

文件名称: IEC60664-3-2016低压系统内设备的绝缘配合第3部分用于污染防护的涂层、封装或模塑的使用.pdf

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详细说明：IEC60664-3-2016低压系统内设备的绝缘配合第3部分用于污染防护的涂层、封装或模塑的使用EC60664-3:2016|EC2016 Figure 1- Scratch-resistance test for protecting layers Figure C. 1-Configuration of the test specimen 23 Figure C 2-Configuration of lands and adjacent conductors 24 Table 1- Minimum spacings for type 2 protection .10 Table 2-Dry-heat conditioning . 14 Table 3-Degrees of severities for rapid change of temperature .............. 14 Table A. 1-Test sequence 1.................................................... Table A 2-Test sequence 2 additiona\ conditioning with respect to electromigration...18 19 Table A3-Additional tests ,19 4 EC60664-3:2016|EC2016 INT TERNATIONAL ELECTROTECHNICAL COMMISSION INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOL TAGE SYSTEMS Part 3: Use of coating, potting or moulding for protection against pollution FOREWORD all national electrotechnical committees (EC National Committees ) The object of IEc is to promote intarnational co-operation on all questions concerning standardization in the electrical and electronic fields. to this end and in addit on to other activities, IEC publishes International Standards, Technical Specifications Technical Reports, Publicly Available Specifications (PAS)and Guides hereafter referred to as lEC Publication(s)"). Their preparation is entrusted to technical committees: any IEC National Committee interested in the subject dealt with may participate in this preparatory work. Internaticna, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates close y with the International Organization for Standardization(Iso) in accordance with conditions determined br agreement between the two organizations 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation trom all nterested IEC National Committees 3) IEC Publications have the form of recommendations for international use and are accepted by IEC Naticnal Committees in that sense. while all reasonable efforts are made to ensure that the technical content of lEc Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity r IEC Naticnal Committees undertake to apply IEc Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publicat on shall be clearly indicated in the latter 5) IEC isel「de 「ical assessment services and, in some areas, access to IEc marks of conformity. IEC is not responsible for any services carried out by independent certification bodies 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and nembers of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other lEC Publications 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publicat on Attention is drawn to the rossibility that some of the e ements of this lEC Publication may be the subject o atent rights. IEC shall not be held responsible for identi ying any or all such patent rights International Standard IEC 60664-3 has been prepared by IEC technical committee TC 109 Insulation Co-ordination for low-voltage equipment. It has the status of a basic safety publication in accordance with lEC Guide 104. This third edition cancels and replaces the second edition published in 2003 and amendment 1: 2010. This edition constitutes a technical re vision This edition includes the following significant technical changes with respect to the previous edition a) information added concerning interpolation b) provided scratch test is only for lype 2 protection EC60664-3:2016|EC2016 c)renumbered the scratch test to follow the visual examination test, since it makes more sense there d) separated the tables under what is now called Annex A, to make them clearer The text of this standard is based on the following documents FDIS Report on voting 109/153FD|S 109/154/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table This publication has been drafted in accordance with the iso/IEC Directives, Part 2 In this standard, the following types are used Terms used throughout this standard which have been defined in Clause 3: bold type A list of all parts in the IEC 60664 series, published under the general title insulation coordination for equipment within low-voltage systems, can be found on the lEc website The committee has decided that the contents of this publication will remain unchanged until thestabilitydateindicatedontheiecwebsiteunderhttp://webstore.iecchinthedata related to the specific publication. At this date, the publication will be reconfirmed withdrawn replaced by a revised edition, or amended EC60664-3:2016|EC2016 INTRODUCTION This part of Ec 60664 details the conditions in which the reduction of clearance and creepage distances can apply to rigid assemblies such as printed boards or terminals of components. Protection against pollution can be achieved by any kind of encapsulation such as coating, potting or moulding. The protection may be applied to one or both sides of the assembly. This standard specifies the insulating properties of the protecting material Between any two unprotected conductive parts, the clearance and creepage distance requirements of IEC 60664-1 apply This document refers only to permanent protection. It does not cover assemblies after repa Technical committees should consider the influence on the protection of overheating conductors and components, especially under fault conditions, and to decide if any additional requirements are necessary Safe performance of assemblies is dependent upon a precise and controlled manufacturing process for the application of the protective system. Requirements for quality control, e.g. by sampling tests, should be considered by technical committees EC60664-3:2016|EC2016 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOL TAGE SYSTEMS Part 3: Use of coating, potting or moulding for protection against pollution sc。pe This part of IEC 60664 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664-1 This document describes the requirements and test procedures for two methods of protection: type 1 protection improves the microenvironment of the parts under the protection; type 2 protection is considered to be similar to solid insulation This document also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies, In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in IEC 60664-1 NOTE Examples of substrates are hybrid integrated circuits and thick-film technology This document refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document(including any amendments) applies. lEC 60068-2-1, Environmental testing- Part 2-1: Tests- Test A: Cold IEC 60068-2-2, Environmental testing- Part 2-2: Tests- Test B: Dry heat lEC 60068-2-14, Environmental testing- Part 2-14: Tests- Test N: Change of temperature lEC 60068-2-78, Environmental testing- Part 2-78: Tests Test Cab: Damp heat, steady state IEC 60326-2: 1990, Printed boards- Part 2: Test methods lEC 60454-3-1: 1998/AMD1: 2001, Pressure-sensitive adhesive tapes for electrical purposes Part 3: Specifications for individual materials- Sheet 1: Pvc film tapes with pressurE sensitive adhesive 8 EC60664-3:2016|EC2016 lEC 60664-1: 2007, Insulation coordination for equipment within low-volfage systems- Part 1 Principles, requirements and tests IEC 61189-2: 2006, Test methods for electrica/ materials, printed boards and other interconnection structures and assemblies -Part 2: Test methods for materia/s for interconnection structures IEC 61189-3: 2007, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures(printed boards) lEC 61249-2(all parts), Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad lEC Guide 104: 2010, The preparation of safety publications and the use of basic safety publications and group safety publications I SO/EC Guide 51, Safety aspects- Guidelines for their inclusion in standards 3 Terms and definitions For the purposes of this document, the terms and definitions given in lEC 60664-1 and the following apply ISo and IEC maintain terminological databases for use in standardization at the following addresses lecElectropedia:availableathttp://www.electropedia.org soOnlinebrowsingplatformavailableathttp://www.isoorg/obp 3.1 base material insulating material upon which a conductive pattern may be formed Note 1 to entry: The base material may be rigid or f exible, or both. It may be a dielectric or an insulated metal sheet [ SOURCE:EC60050-541:1990,541-02-01] 3.2 printed board base material cut to size containing all required holes and bearing at least one conductive pattern Printed boards are typically subdivided according to their structure (e.g, single-and double-sided, multilayers) the nature of the base material(e. g. rigid, flexible [ SOURCE:EC60050-541:1990,541-01-03] 3.3 conductor (of a printed board) single conductive path in a conductive pattern [ SOURCE:EC60050-541:1990,541-01-20] EC60664-3:2016|EC2016 9 3.4 protection measure which reduces the influence of the environment 3.5 coating insulating material such as varnish or dry film laid on the surface of the assembl Note 1 to entry: Coating and base material of a printed board form an insulating system that may have properties similar to solid insulation [ SOURCE:EC60050-2122010,212-11-61 solid insulation solid insulating material, or a combination af solid insulating materials, placed between two conductive parts or between a conductive part and a body part EXAMPLE In the case of a printed board with a coating, solid insulation consists of the board itself as well as the coating. In other cases, solid insulation consists of the encapsulating materia [ SOURCE:EC60050-903:2013,903-04-14] 3.7 spacing any combination of clearances, creepage distances and insulation distances through insulation [ SOURCE:|EC60050471:2007,471-01-20] 4 Design requirements 4.1 Principles The dimensioning of s pacings between conductors depends on the type of protection used When type 1 protection is used, dimensioning of clearances and creepage distances shall follow the requirements of IEC 60664-1. If the requirements of this standard are met, pollution degree 1 applies under the protection When type 2 protection is used, spacings between conductive parts shall meet the requirements and tests for solid insulation of lEC 60664-1 and their dimensions shall not be less than the minimum clearances specified in IEC 60664-1 for homogeneous field conditions 4.2 Application range with regards to the environment The design requirements are applicable in all microenvironments Stresses such as temperature, chemical or mechanical stresses, ar thase listed in 5.3.2. 4 of lEC 60664-1: 2007 shall be taken into account when the protective material is selected Absorption of humidity by the protective material shall not impair the insulation properties of the parts being protected NoTE Absorption of humidity can be checked by an insulation resistarce measurerment under humid conditions -10 EC60664-3:2016|EC2016 4.3 Requirements for the ty pes of protection Protection is achieved in the following ways Type 1 protection improves the microenvironment of the parts under the protection. the clearance and creepage distance requirements of IEc 60664-1 for pollution degree 1 apply under the protection. Between two conductive parts, it is a requirement that one or both conductive parts, together with all the spacings between them, are covered by the protection Type 2 protection is considered to be similar to solid insulation. Under the protection the requirements for solid insulation specified in Ec 60664-1 are applicable and the spacings shall be not less than those specified in Table 1. The requirements for clearances and creepage distances in IEC 60664-1 do not apply. Between two conductive parts, it is a requirement that both conductive parts, together with all the spacings between them, are covered by the protection so that no air gap exists between the protective material, the conductive parts and the printed board Clearance and creepage distance requirements according to IEC 60664-1 apply to all unprotected parts of the equipment 4.4 Dimensioning procedures For type 1 protection, the dimensioning requirements of 5. 1 and 5.2 of IEC 60664-1: 2007 apply. For type 2 protection, the spacing between the conductors before the protection is applied shall not be less than the values as specified in Table 1. These values apply to basic insulation, supplementary insulation as well as reinforced insulation. These values may alsc be applied to functional insulation NOTE In case of multi-layer boards, the spacing between the conductors at the surface of inner layers is dimens oned as speclfled for type 1 protection or type 2 protection depending on the result of the tests on the protection Table 1- Minimum spacings for type 2 protection Maximum peak value of any voltage a Minimum spacings ≤0,33 0,01 >0,33and≤0,4 0.02 >0,4and≤0,5 0.04 >0,5and≤0,6 0.06 >0,6and≤0,8 >0,8and≤1,0 0,15 1,0and≤1,2 0,2 1,2and≤1,5 0,3 1,5and≤2,0 0,45 >2,0and≤2,5 0,6 2,5and≤3,0 0.8 3,0and≤4,0 1.2 >4,0and≤5.0 1,5 50and≤6,0 2 >6,0ard≤8,0 3 8,0and≤10 3,5

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