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详细说明:SX12112是Semtech的集成UHF频段接收器。SX1212用于868MHz、915MHz频段,其它各参数完全相同且管脚兼容。SX1212的接收电流不到3mA,为业界最低,与竞争对手相比,接收电流要低6倍。设计应用于无线报警器、安全,家庭自动化中的传感器网络,以及自动化抄表领域。
该器件支持FSK数据速率为1.56~200kbps,OOK数据速率高达32kbps。25kbps时FSK调制的接收器灵敏度为 -107dBm;2kbps时OOK接收器灵敏度为-113dBm。此外,该芯片符合欧洲(ETSI EN 300-220 V2.1.1)和南美(FCC Part 15.247和15.249)SEMECH
Figure 1: SX1212 Simplified Block Diagram
Figure 33: Sync Word Recognition
.40
Figure2:S×1212 Pin Diagran…
6
Figure 34: Continuous Mode conceptual view
Figure3:s×1212 Detailed Block Diagram…
Figure 35: Tx Processing in Continuous Mode
Figure 4: Power Supply Breakdown
Figure 36: Rx Processing in Continuous Mode
Figure 5: Frequency Synthesizer Description
Figure 37: uC Connections in Continuous mode
4444
Figure 6: LO Generator
Figure 38: Buffered Mode Conceptual view
Figure7: Loop Filter………
16
Figure 39: Tx processing in Buffered Mode(FIFo size =16,
Figure 8: Transmitter Architecture
18
T× start irq_0=0
Figure 9: I(t), Q(oVerview
Figure 40: Rx Processing in Buttered Mode(FIFo Size=16
Figure 10: PA Control
21
Fifo fill method=0)
Figure 11: Optimal Load Impedance Chart
Figure 41: uC Connections in Buffered Mode
Figure 12: Recommended PA Biasing and Output Matching
igure 42: Packet Mode Conceptual View
Figure 13: Front-end Description
Figure 43: Fixed Length Packet Format
Figure 14: Receiver Architecture
Figure 44: Variable Length Packet Format
Figure 15: FSK Receiver Setting
Figure 45: CRC Implementation
Figure 16: OOK Receiver Setting
23
Figure 46: Manchester Encoding/Decoding
Figure 17: Active Channel Filter Description
Figure 47: Data Whitening
Figure 18: Butterworth Filter's Actual BW
26
Figure 48: uC Connections in Packet Mode.........55
Figure 19: Polyphase Filter's Actual BW
26
Figure 49: Optimized Rx cycle
.67
Figure 20: RSSI Dynamic Range
Figure 50: Optimized Tx Cycle
68
Figure 21: RSSI IRQ Timings
28
Figure 51: Tx Hop Cycle
Figure 22: OOK Demodulator Description
Figure 52: RX Hop Cycle
70
Figure23: Floor Threshold Optimization……
Figure53:Rx→Tx÷ Rx Cycle
Figure 24: BitSync Description
Figure 54: POR Timing Diagram
Figure 25: SX1212's Data Processing conceptual view
34
Figure 55: Manual Reset Timing Diagram
Figure 26: SPI Interface Overview and uC connections
Figure 56: Reference Design Circuit Schematic
Figure 27: Write Register Sequence
36
Figure 57: Reference Design's Stackup
74
Figure 28: Read Register Sequence
37
Figure 58: Reference Design Layout( top view
Figure 29: Write Bytes Sequence(ex: 2 bytes)
37
Figure59: Package Outline Drawing……………
75
Figure 30: Read Bytes Sequence(ex: 2 bytes)
Figure 60: PCB Land Pattern
Figure 31: FIFo and shift Register (SR)
38
Figure 61: Tape Reel Dimensions
Figure32: FIFO Threshold IRQ Source Behavior…………….39
Rev 2-June 1 8th 2009
Page 3 of 77
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SEMECH
Table 1: Ordering Information...
Table 19: Relevant Configuration Registers in Continuous Mode
Table 2: SX1212 Pinouts
(data processing related only
Table 3: Absolute Maximum Ratings
8
Table 20: Interrupt Mapping in Buffered Rx and Stby Modes... 46
Table 4: Operating Range
Table 21: Interrupt Mapping in Tx Buffered Mode
Table 5: Power Consumption Specification
Table 6: Frequency Synthesizer Specification
88990
Table 22: Relevant Configuration Registers in Buffered Mode(data
processing related only)……
Table 7: Transmitter Specification
Table 23: Interrupt Mapping in Rx and Stby in Packet Mode..55
Table 8: Receiver Specification
Table 24: Interrupt Mapping in Tx Packet Mode
T able 9: Digital Specification
Table 25: Relevant Configuration Registers in Packet Mode(data
Table 10: MCParam Freq band Setting
processing related only
Table 11: Pa rise/fall times
Table 26: Registers list
5688
Table 12: Operating Modes
335
Table 27: MCParam Register Description
Table 13: Pin Configuration Vs Chip Mode
Table
28: IRQParam Register Description
Table 14: Data Operation Mode selection
Table 29: RXParam Register Description
Table 15: Config vS Data SPI Interface Selection
Table 30: SYNCParam Register Description
Table 16: Status of FIFO when Switching Between Different
Table 31: TXParam Register Description
Modes of the Chip
Table 32: OSCParam Register description
6
Table 17: Interrupt Mapping in Continuous Rx mode
Table 33: PKTParam Register Description
65
Table 18: Interrupt Mapping in Continuous Tx Mode
Table 34: Crystal Resonator Specification
66
Table 35: Reference Design BOM...
74
BOM
Bill of materials
Local oscillator
BR
Bit rate
LSB
Least Significant Bit
BW
Bandwidth
MSB
Most Significant Bit
CCITT
Comite consultatif internationa
NRZ
Non return to zero
Telephonique et telegraphique -ITU
NZF
Near Zero Intermediate Frequency
CP
Charge Pump
OOK
On Off Keying
CRC
Cyclic Redundancy Check
PA
Power Amplifier
DAC
Digital to Analog Converter
PCB
Printed Circuit board
DDS
Direct Digital Synthesis
PFD
Phase Frequency Detector
DLL
Dynamically Linked Library
PLL
Phase-Locked Loap
ERP
quivalent radiated Power
PO
Power on reset
ETS
European Telecommunications Standards
DR
Institute
RBW
Resolution bandwidth
FCC
Federal communications commission
RF
Radio Frequency
Fdev
Frequency Deviation
RSS
Received Signal Strength Indicator
FIFO
First In first out
RX
Receiver
FS
Frequency Synthesizer
SAW
Surface Acoustic Wave
FSK
Frequency Shift Keying
SPI
Serial Peripheral Interface
GUI
Graphical User Interface
SR
Shift Registe
C
Integrated Circuit
Stby
Standb
D
IDentificator
Transmitter
F
Intermediate Frequency
Microcontroller
IRQ
Interrupt ReQuest
VcO
Voltage Controlled Oscillator
ITU International telecommunication Union
XO
Crystal Oscillator
LFSR
Linear Feedback Shift Register
XOR
eXclusive or
LNA
Low Noise Amplifier
Rev 2-June 1 8th 2009
Page 4 of 77
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SEMECH
This product datasheet contains a detailed description of the sX1212 performance and functionality. Please consult
the Semtech website for the latest updates or errata
The SX1212 is a single chip FSK and ooK transceiver capable of operation in the 300 to 51OMHz license free ISM
frequency bands. It complies with both the relevant European and North American standards, EN 300-220 V2 1.1
(June 2006 release) and FCC Part 15(10-1-2006 edition). A unique feature of this circuit is its extremely low
current consumption in receiver mode of only 3mA (typ)
The sX1212 comes in a 5x5 mm TQFN-32 package
Transmission
Phaso-ah to frequancy ah
2 nd stag日
1st Stage
Modulation earrvari'on(FBK Mada
M
HOoS, DACs,
KEE
Q
Q
IneptaOt
01T
on
RSSI
coκ DarTed
Digital
Demodulator
LNA
1st Stage H-IF Gait +-2nd Stage
Filtering
Mixers
adi
FSK DITKA
CLKOUT
Mixers
DETA
Control
C Ri
Lo2 i
Sync word
equency
PLL
卡L7
F凵LLoK
Synthesis
上 ampara veo
Fter, Dividers)
FIFg
Post Demod
XTAL
Dop Fle
Rev 2-June 1 8th 2009
Page 5 of 77
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SEMECH
The following diagram shows the pins arrangement of the QFN package, top view
β望g
1 TEST5
24 TEST2
10 GND
2 TEST1
23 PLL LOCK
3 VR VCO
22|RQ_1
4 VCO M
二21RQo
yyww
5 VCO P
20 DATA
6 LE M
1 9 CLKOUT
7 LF P
18 SCK
u
8 TEST6
17 MOSI
Dimensions. 5 mm x 5 mm
Lead Pitch: 0.5 mm
(Leads centered on package)
Note pino- GRoUND located
on the underside of the package
11002p0
Notes:
yyww refers to the date code
--- refers to the lot number
Rev 2-June 1 8th 2009
Page 6 of 77
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SEMECH
0
GND
Exposed ground pad
TEST5
l/O
Connect to gnd
TEST1
v/O
Connect to gnD
3
VR_VCO
Regulated supply of the Vco
4
VCO M
VcO tank
VCO P
vO
VcO tank
LF M
vO
PLL loop fil
LE P
v/O
PLL loop filter
8
TEST6
v/O
Connect to gnd
TESTi
v/O
Connect to gnD
10
XTAL P
vO
Crystal connection
11
XTAL M
vO
Crystal connection
12
TESTO
Connect to gnD
13
Tests
/O POR. Do not connect if unused
14 NSS_CONFIG
SPI CONFIG enable
15
NSS DATA
SPI DATA enable
16
MISO
sPl data output
17
MOSI
SPI data input
18
SCK
SPI clock input
19
CLKOUT
Clock output
DATA
vO
nrZ data input and output(Continuous mode)
IRQ O
Interrupt output
IRQ 1
Interrupt outpu
PLL LOCK
PLL lock detection output
24
TEST2
No connect
25
TEST3
vO
Connect to gnd
26
VDD
Supply voltage
27
VR 1V
O
Regulated supply of the analog circuitry
28
VR DIG
●
Regulated supply of digital circuitry
29
VR PA
Regulated supply of the PA
TEST4
v/O
Connect to gnd
31
RFIO
/O INput/output
NC
Connect to gnd
Note: pin 13 Test 8) can be used as a manual reset trigger. See section 7. 4.2 for details on its use
Rev 2-June 1 8th 2009
Page 7 of 77
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SEMECH
The SX1212 is a high performance radio frequency device. It satisfies
Class 2 of the JEdEC standard JESD22-A114-B (Human Body Model), except on pins 3-4-5-27-28-29-31
Where it satisfies class 1A
Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum
ratings for extended periods may affect device reliability
VDDmr
Supply voltage
Tmr
Storage temperature
55
125
Pmr
Input level
0
dBm
VDDop Supply Voltage
2.1
3.6
Trop Temperature
40
+85C
ML
Input Leve
0
dBr
Conditions: Temp= 25C, VDd = 3.3 V, crystal frequency =12.8 MHz, carrier frequency =434 MHz, modulation
FSK, data rate= 25 kb/s, Fdev=50 kHz, fc= 100 kHz, unless otherwise specified
IDDSL
Supply current in sleep
mode
0.1
2
UA
IDDST
Supply current in standby
mode clKout disabled
Crystal oscillator running
65
85
A
IDDES
Supply current in FS mode
Frequency synthesizer
1.3
1.7
A
runnIng
IDDR
Supply current in receiver
3.0
3.5
mode
25
30
MA
IDDT
Supply current in
Output power =+10 dBm
transmitter mode
Output power= 1dBm
16
21
mA
1) Guaranteed by design and characterization
Rev 2-June 1 8th 2009
Page 8 of 77
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SEMECH
300
330
MHZ
350
MHZ
FR
Programmable
350
390
MH
Frequency ranges
(may require specific BOM)
390
430
MHZ
430
470
MH
470
510
MH
BR F
Bit rate(FSK)
NRZ
0.78
150
Kb/s
BR O
Bit rate(OOK)
NRZ
0.78
32
Kb/s
FDA
Frequency deviation(FSK)
33
50
200
KHz
XTAL
I Crystal oscillator frequency
12.8
15
MHZ
FSTEP
Frequency synthesizer
Variable, depending on the
2
KHz
step
frequency.
Oscillator wake-up time
From Sleep mode
ms
Frequency synthesizer
TS FS
wake-up time at most
10 kHz away from the
From Stby mode
500
800
target
200 kHz step
180
1 MHz step
200
Frequency synthesizer hop/5 MHz step
250
TS HOP
time at most 10 kHz away 7 MHz step
260
us
from the target
12 MHz step
290
s
20 MHZ step
320
s
27 MHz step
340
us
Guaranteed by design and characterization
RF output power,
Maximum power setting
+12.5
d Bm
RFOP
programmable with 8 steps
of typ. 3dB
Minimum power setting
-8.5
d Bm
Measured with a 600 kHz
PN
Phase noise
offset at the transmitter
112
d Bc/hz
output
At any offset between
SPT
Transmitted spurious
200 kHz and 600 kHz
unmodulated carrier Fdev
47
d Bc
50 kH
TS TR
Transmitter wake-up time From FS to Tx ready
120
500
us
'S TR2 Transmitter wake-up time From Stby to Tx ready.
600900μs
Guaranteed by design and characterization
Rev 2-June 1 8th 2009
Page 9 of 77
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SEMECH
On the following table, fc and fo describe the bandwidth of the active channel filters as described in section 3. 4.4.2
All sensitivities are measured receiving a Pn15 sequence, for a ber of o.%
434 MHz. BR=25 kb/s Fdev
=50 kHz. fc=100 kH
-104
dBm
RES F
Sensitivity(FSK)
434 MHz. 2kb/s nrz
-110
dBm
fc-fo=50 kHz. fo=50 khz
RFS O
Sensitivity(ooK)
CCR
Co-channel rejection Modulation as wanted signal
-12
d Bc
dB
ACR
Adjacent channel
Offset=300 kHz
Offset 600 kHz
42
dB
rejection
Offset=1.2 MHz
Offset= 1 MHz
53
dBc
unmodulated
blocking immuni
Offset=2 MHz
unmodulated. no saw
Offset= 10 MHz
unmodulated. no saw
RXBW Fl12) Receiver bandwidth in
Single side BW
FSK mode
Polyphase Off
50
250
k卜
RXBW O(1,2)
Receiver bandwidth in
Single side BW
OoK mode
Polyphase On
50
400
z
lP3
Input 3 order intercept Interferers at 1 MHz and
1.950 MHz offset
28
dBm
poIn
TS RE( Receiver wake-up time From Fs to Rx ready
280
500
'S RE2 Receiver wake-up time From Stby to Rx ready
900
200 kHz ste
400
1MHz step
400
ps
Receiver hop time from
5MHZ step
460
TS_RE_HOP RX ready to RX ready with 7MHz step
480
a frequency hop
12MHz step
520
20MHz step
550
us
27MHz step
600
'S_RSSI RSSI sampling time From Rx ready
I 1/Fdev s
DR RSSI
RSSI dynamic Range Ranging from sensitivity
70
dB
Information from design and characterization
(2)This reflects the whole receiver bandwidth as described in sections 3.4.4.1 and 3.4.4.2
Rev 2-June 1 8th 2009
Page 10 of 77
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