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详细说明:MLX90640-Datasheet-Melexis 迈莱芯90640 红外分辨率32x24 FOV视场角110°x75°、55°x35°传感器特性参数及使用手册MLX90640 32X24 IR array
Melexis
Datasheet
INSPIRED ENGINEERING
11. 1.9. Restoring corner temperatures(common for all pixel)
11.1.10. Restoring the KsTo coefficient (common for all pixels)
…27
11.1.11. Restoring sensitivity correction coefficients for each temperature range
27
11.1.12 Restoring the Sensitivity aCP
11. 13. Restoring the offset of the Compensation Pixel(CP)
28
11. 1. 14. Restoring the Ky Cp coefficient
28
11.1.15. Restoring the Kta CP coefficient
28
11.. Restoring the TGC coefficient
11.1.17. Restoring the resolution control coefficient
11.2. Temperature Calculation
11.2.1. Example Input Data..
30
11.2. 2 Temperature calculation
35
12. Performance graphs
47
12.1. Accuracy
47
Startup time
……….49
12.1.1. First valid data
49
12. 1.2, Thermal behavior
12.2. Noise performance and resolution
123. Field of view(FO)……
52
13. Application information
53
13. 1. Electrical considerations
53
13.2. Using the device in"image mode
14. Application Comments…,,….,,…
54
15. Mechanical drawings……………………………………………
15.1.FOV55°
15.2.FOV110°
57
15.3. Device marking
16. Standard Information
59
17. ESD Precautions
59
18. Revision history table
19. Contact
60
20. Disclaimer
……,60
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MLX90640 32X24 IR array
Melexis
Datasheet
INSPIRED ENGINEERING
Tables
Table 1 Ordering information
6
Table 2 Glosarry of terms.
Table 3 Pin defin ition
Table 4 Absolute maximum ratings
Table 5 Electrical specification
Table 6 Priorities of subpage controls(0X0800D)
Tabe7 Configuration parameters memory……
19
Table 8 EEPROM to registers mapping
Table 9 EEPROM overview(words)
Table 10 Calibration parameters memory(EEPROM-bits
21
Table 11 Calculation example input data.........
Table 12 Calculation example calibration data
Table 13 XoR truth table
…………………
42
Table 14 Noise performance
Table 15 Available Fov options.....
52
Table 16 Revision history
gures
Figure 2 MLX90640 Over
d pin descript
Figure 3 Pixel in the whole Fov.
.10
gure 4 IC write command format(default SA=0x 33 is used
Figure 5 IC read command format(default SA=0X 33 is used)..
Figure 6 Refresh rate timing
12
Figure 7 Recommended measurement flow
Figure 8 TV mode reading pattern only highlighted cells are updated)
Figure 9 Chess reading pattern (only highlighted cells are updated )........
15
Figure10MXL90640 memory map………,…,…
Figure 11 Status register(0x8000)bits meaning
Figure 12 Control register1(0x800D)bits mear
Figure 13 I"C configuration register(0x800F)bits meaning
Figure 14 RAM memory map( Chess pattern mode )-factory default mode
18
Figure 15 RAM memory map(Interleaved mode)
18
Figure 16 To calculation flow
Figure 17 Absolute temperature accuracy-MLX90640BAA (left)and MLX90640BAB (right)
47
Figure 18 Different accuracy zones depending on device type(baa on the left and bab on the right
Fgre20Mx608 AA noise vs pixel and refresh rate at 1Hz and 2Hz….…
Figure 19 MLX90640B Ax noise vs refresh rate for different device types.....
Figure 21 MLX90640BAA noise vs pixel and refresh rate at 4Hz, 8Hz and 16Hz.
Figure 22 MLX90640BAB noise vs pixel and refresh rate at 1 Hz and 2Hz
Figure 23 MLX90640BAB noise vs pixel and refresh rate at 4Hz, 8Hz and 16Hz,
Figure 24: Field Of View measurement...
Figure 25 MLX90640 electrical connections
Figure 26 Calculation flow in thermal image mode....
Figure 27 Mechanical drawing of 55 Fov device.
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MLX90640 32X24 IR array
Melexis
Datasheet
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Figure 28 Mechanical drawing of 110"Fov device
57
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MLX90640 32X24 IR array
Melexis
Datasheet
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4. Ordering Information
Product
Packing
Temperature Package Option Code Confiquration Fc
De
efinition
orm
MLX90640
E
SF
BAA
000
TU
32x24 IR array
MLX90640
SF
BAB
000
32X24 IR array
Legend:
Temperature Code:E:-40°cto85°C
Package Code:"SF"for TO39 package
Option Code: XAx-TGC is disabled and may not be changed
Option Code:xxA-FOV=110°×75
XxB-FoV=55°35°
Custom configuration 000-standard product
Packing Form:"TU"-Tubes
Ordering Example:“MLx90640EsF-BAA000TU”
Table 1 Ordering information
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MLX90640 32X24 IR array
Melexis
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5. Glossary of Terms
Temperature Coefficient(in ppm/'C)
POR
Power on reset
R
Infra-Red
Ambient Temperature-the temperature of the to39 package
iR data
Infrared data(raw data from ADC proportional to ir energy received by the sensor
ADC
Analog To Digital Converter
TGC
Temperature Gradient Coefficient
FOV
Field of View
nFOV
Field Of View of the N-th pixel
Inter-Integrated Circuit com munication protocol
SDA
ata
Serial Clock
LSB
Least Significant Bit
MSB
Most Significant Bit
Frames per Second-data refresh rate
MD
Master device
SD
Slave devic
Analog Signal Processing
DSP
Digital Signal Processing
ESD
Electro Static Discharge
EI
MO
Electro Magnetic Compatibility
Compensation Pixel
Not connected
NA
Not Applicabl
TBD
To Be Defined
Table 2 Glosarry of terms
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MLX90640 32x24 IR array
M
eleXIs
Datasheet
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6. Pin Definitions and Descriptions
Pin #f
Name
Description
SDA
o IC serial data(input /output)
VDD
ositive supply
GND
Negative supply(Ground
4
IC serial clock(input only
SCL
SDA
GND
VDD
Figure 2 MLX90640 Overview and pin description
7. Absolute Maximum Ratings o
Parameter
Symbol Min. Typ.
Unit
Remark
Supply Voltage (over voltage)
Supply Voltage(operating max voltage)
3.6
Reverse Voltage(each pin)
-0.3
Operating Temperature
-40
+85
C
Storage Temperatu
Ts-40
+125C
Not in plastic tubes
ESD sensitivity (AEC Q100 002)
SDA DC Sink current
Table 4 Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-rated
conditions for extended periods may affect device reliability.
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MLX90640 32X24 IR array
Melexis
Datasheet
INSPIRED ENGINEERING
8. General Electrical Specifications
Electrical Parameter
Symbol
Typ.
Max
Unit
Condition
Supply voltage
3.3
3.6
Supply current
15
25
mA
POR level up analog
2.6V
VDD rising
POR level down analog
POR DOWN
2.5
∨ VDd falling
POR hysteresis
POR hy
50
Default IC address
0x01
Ox33 OxFF
Input
voltage
0.7*Vb
V Over Ta and V
(SDA,
Input low voltage
V
0.3*V
(SDA, SCL)
V Over Ta and v
Over Ta and vop
SDA output low voltage
V
0.4
SINK=3mA
SDA leakage
Da leak
±10μ A VsDA=36V,Ta=85C
SCL leaka
±10AVsc=3.6VTa=85°C
SDA capacitance
SCL capacitance
Acknowledge setup time
TSUAC(MD
0.45
Acknowledge hold time
TDUAC(MDI
0.45
Acknowledge setup time
UACISD
0.45
Acknowledge hold time
TDi
UACS
0.45
1c clock frequency
0.4
MHz
EEPROM erase/ write cycles
.o times
Write cell time
WRITE
Table 5 Electrical specification
NOTE: For best performance it is recommended to keep the supply voltage as accurate and stable as possible to 3. 3V+
0.1V
NOTE 2: When a data in EEPROM cell to be changed an erase(write 0x0000 must be done prior to writing the new
value. After each write at least 5ms delay is needed in order to writing process to take place
NOTE 3: Slave address Ox00 must be avoided
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MLX90640 32X24 IR array
Melexis
Datasheet
INSPIRED ENGINEERING
9. False pixel correction
The imager can have up to 4 defective pixels, with either no output or out of specification temperature reading
These pixels are identified in the eeprom table of the sensor and can be read out through the I"C. the defective pixel
result can be replaced by an interpolation of its neighboring pixels
10. Detailed General Description
10.1. Pixel position
The array consists of 768 IR sensors (also called pixels). Each pixel is identified with its row and column position as
Pix(i,i) where i is its row number (from 1 to 24) and j is its column number(from 1 to 32)
c
8
888
Row 2
■■■■■■□■□
口■■■■口圖■■■■■■口■
□^■■■□■■■口■■7■■
Row 2
GND
SDA-NSCL
Reference tab
Figure 3 Pixel in the whole FOV
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