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文件名称: MLX90640 传感器使用手册
  所属分类: 硬件开发
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  文件大小: 13mb
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  上传时间: 2019-03-17
  提 供 者: qq_15******
 详细说明:MLX90640-Datasheet-Melexis 迈莱芯90640 红外分辨率32x24 FOV视场角110°x75°、55°x35°传感器特性参数及使用手册MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING 11. 1.9. Restoring corner temperatures(common for all pixel) 11.1.10. Restoring the KsTo coefficient (common for all pixels) …27 11.1.11. Restoring sensitivity correction coefficients for each temperature range 27 11.1.12 Restoring the Sensitivity aCP 11. 13. Restoring the offset of the Compensation Pixel(CP) 28 11. 1. 14. Restoring the Ky Cp coefficient 28 11.1.15. Restoring the Kta CP coefficient 28 11.. Restoring the TGC coefficient 11.1.17. Restoring the resolution control coefficient 11.2. Temperature Calculation 11.2.1. Example Input Data.. 30 11.2. 2 Temperature calculation 35 12. Performance graphs 47 12.1. Accuracy 47 Startup time ……….49 12.1.1. First valid data 49 12. 1.2, Thermal behavior 12.2. Noise performance and resolution 123. Field of view(FO)…… 52 13. Application information 53 13. 1. Electrical considerations 53 13.2. Using the device in"image mode 14. Application Comments…,,….,,… 54 15. Mechanical drawings…………………………………………… 15.1.FOV55° 15.2.FOV110° 57 15.3. Device marking 16. Standard Information 59 17. ESD Precautions 59 18. Revision history table 19. Contact 60 20. Disclaimer ……,60 REVISION 11-3 AUGUST 2018 Page 3 of MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING Tables Table 1 Ordering information 6 Table 2 Glosarry of terms. Table 3 Pin defin ition Table 4 Absolute maximum ratings Table 5 Electrical specification Table 6 Priorities of subpage controls(0X0800D) Tabe7 Configuration parameters memory…… 19 Table 8 EEPROM to registers mapping Table 9 EEPROM overview(words) Table 10 Calibration parameters memory(EEPROM-bits 21 Table 11 Calculation example input data......... Table 12 Calculation example calibration data Table 13 XoR truth table ………………… 42 Table 14 Noise performance Table 15 Available Fov options..... 52 Table 16 Revision history gures Figure 2 MLX90640 Over d pin descript Figure 3 Pixel in the whole Fov. .10 gure 4 IC write command format(default SA=0x 33 is used Figure 5 IC read command format(default SA=0X 33 is used).. Figure 6 Refresh rate timing 12 Figure 7 Recommended measurement flow Figure 8 TV mode reading pattern only highlighted cells are updated) Figure 9 Chess reading pattern (only highlighted cells are updated )........ 15 Figure10MXL90640 memory map………,…,… Figure 11 Status register(0x8000)bits meaning Figure 12 Control register1(0x800D)bits mear Figure 13 I"C configuration register(0x800F)bits meaning Figure 14 RAM memory map( Chess pattern mode )-factory default mode 18 Figure 15 RAM memory map(Interleaved mode) 18 Figure 16 To calculation flow Figure 17 Absolute temperature accuracy-MLX90640BAA (left)and MLX90640BAB (right) 47 Figure 18 Different accuracy zones depending on device type(baa on the left and bab on the right Fgre20Mx608 AA noise vs pixel and refresh rate at 1Hz and 2Hz….… Figure 19 MLX90640B Ax noise vs refresh rate for different device types..... Figure 21 MLX90640BAA noise vs pixel and refresh rate at 4Hz, 8Hz and 16Hz. Figure 22 MLX90640BAB noise vs pixel and refresh rate at 1 Hz and 2Hz Figure 23 MLX90640BAB noise vs pixel and refresh rate at 4Hz, 8Hz and 16Hz, Figure 24: Field Of View measurement... Figure 25 MLX90640 electrical connections Figure 26 Calculation flow in thermal image mode.... Figure 27 Mechanical drawing of 55 Fov device. REVISION 11-3 AUGUST 2018 Page 4 of 60 MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING Figure 28 Mechanical drawing of 110"Fov device 57 REVISION 11-3 AUGUST 2018 Page 5 of 60 MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING 4. Ordering Information Product Packing Temperature Package Option Code Confiquration Fc De efinition orm MLX90640 E SF BAA 000 TU 32x24 IR array MLX90640 SF BAB 000 32X24 IR array Legend: Temperature Code:E:-40°cto85°C Package Code:"SF"for TO39 package Option Code: XAx-TGC is disabled and may not be changed Option Code:xxA-FOV=110°×75 XxB-FoV=55°35° Custom configuration 000-standard product Packing Form:"TU"-Tubes Ordering Example:“MLx90640EsF-BAA000TU” Table 1 Ordering information REVISION 11-3 AUGUST 2018 ge 6 of 60 MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING 5. Glossary of Terms Temperature Coefficient(in ppm/'C) POR Power on reset R Infra-Red Ambient Temperature-the temperature of the to39 package iR data Infrared data(raw data from ADC proportional to ir energy received by the sensor ADC Analog To Digital Converter TGC Temperature Gradient Coefficient FOV Field of View nFOV Field Of View of the N-th pixel Inter-Integrated Circuit com munication protocol SDA ata Serial Clock LSB Least Significant Bit MSB Most Significant Bit Frames per Second-data refresh rate MD Master device SD Slave devic Analog Signal Processing DSP Digital Signal Processing ESD Electro Static Discharge EI MO Electro Magnetic Compatibility Compensation Pixel Not connected NA Not Applicabl TBD To Be Defined Table 2 Glosarry of terms REVISION 11-3 AUGUST 2018 Page 7 of 60 MLX90640 32x24 IR array M eleXIs Datasheet INSPIRED ENGINEERING 6. Pin Definitions and Descriptions Pin #f Name Description SDA o IC serial data(input /output) VDD ositive supply GND Negative supply(Ground 4 IC serial clock(input only SCL SDA GND VDD Figure 2 MLX90640 Overview and pin description 7. Absolute Maximum Ratings o Parameter Symbol Min. Typ. Unit Remark Supply Voltage (over voltage) Supply Voltage(operating max voltage) 3.6 Reverse Voltage(each pin) -0.3 Operating Temperature -40 +85 C Storage Temperatu Ts-40 +125C Not in plastic tubes ESD sensitivity (AEC Q100 002) SDA DC Sink current Table 4 Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability. REVISION 11-3 AUGUST 2018 Page 8 of 60 MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING 8. General Electrical Specifications Electrical Parameter Symbol Typ. Max Unit Condition Supply voltage 3.3 3.6 Supply current 15 25 mA POR level up analog 2.6V VDD rising POR level down analog POR DOWN 2.5 ∨ VDd falling POR hysteresis POR hy 50 Default IC address 0x01 Ox33 OxFF Input voltage 0.7*Vb V Over Ta and V (SDA, Input low voltage V 0.3*V (SDA, SCL) V Over Ta and v Over Ta and vop SDA output low voltage V 0.4 SINK=3mA SDA leakage Da leak ±10μ A VsDA=36V,Ta=85C SCL leaka ±10AVsc=3.6VTa=85°C SDA capacitance SCL capacitance Acknowledge setup time TSUAC(MD 0.45 Acknowledge hold time TDUAC(MDI 0.45 Acknowledge setup time UACISD 0.45 Acknowledge hold time TDi UACS 0.45 1c clock frequency 0.4 MHz EEPROM erase/ write cycles .o times Write cell time WRITE Table 5 Electrical specification NOTE: For best performance it is recommended to keep the supply voltage as accurate and stable as possible to 3. 3V+ 0.1V NOTE 2: When a data in EEPROM cell to be changed an erase(write 0x0000 must be done prior to writing the new value. After each write at least 5ms delay is needed in order to writing process to take place NOTE 3: Slave address Ox00 must be avoided REVISION 11-3 AUGUST 2018 Page 9 of 60 MLX90640 32X24 IR array Melexis Datasheet INSPIRED ENGINEERING 9. False pixel correction The imager can have up to 4 defective pixels, with either no output or out of specification temperature reading These pixels are identified in the eeprom table of the sensor and can be read out through the I"C. the defective pixel result can be replaced by an interpolation of its neighboring pixels 10. Detailed General Description 10.1. Pixel position The array consists of 768 IR sensors (also called pixels). Each pixel is identified with its row and column position as Pix(i,i) where i is its row number (from 1 to 24) and j is its column number(from 1 to 32) c 8 888 Row 2 ■■■■■■□■□ 口■■■■口圖■■■■■■口■ □^■■■□■■■口■■7■■ Row 2 GND SDA-NSCL Reference tab Figure 3 Pixel in the whole FOV REVISION 11-3 AUGUST 2018 Page 10 of 60
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