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zynq-ultrascale器件选型资料2019最新
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详细说明:zynq-ultrascale-plus-product-selection-guide 器件选型资料2019年最新更新Zynga UltraScalet TM MPSoCs: CG Block Diagram
Processing System
Application Processing Unit
Memory
System
High-Speed
unctions
Connectivity
ARM③
NEON
CortexTM-A53
DDR4/3/3L
Floating Point Unit
LPDDR4/3
Multichannel dma
32KB
32KB
32/64-Bit W/ ECC
- Cache‖D- Cache‖ Management
Trace
W/Parity
W/ECC
Unit
Macrocell
Timers
256KB OCM
with Ecc
WDT Resets
Clocking Debug
G|C-400
SCU
CCl/SMMU 1MB L2 W/ECC
Real-Time Processing Unit
Platform
Configuration and
GeneralConnectivity
Vector Floating
Management Uni
Security Unit
ARM
Point unit
System
Config AES
CortexTM-R5
Memory Protection
Management
Decryption
Authentication
128KB
32KB I-Cache 32KB D-Cache
Power
Secure boot
TCM W/ECC
W/ECC
W/ECC
Management
Voltage/Temp
Functional
Monito
GIC
Safety
Trustzone
Programmable Logic
System Monitor
Storage Signal Processing
Block rAm
General-Purpose 1/0
High-Speed Connectivity
UltraRAM
High-Performance HP I/O
GTH
DSP
High-Density HD /0
PCle Gen 3
ⅩLINX
Zynga Ultra Scale+ TM MPSoCs: CG Devices
Device Name(l) Zu2c ZU3CG ZU4CG ZU5CG ZU6CG ZU7CG ZU9CG
Application
Processor core
Dual-core ARM CortexTM-A53 MP Core TM up to 1.3GHZ
Processor unit
Memory W/ECC
L1 Cache 32KB l/d per core, L2 Cache 1MB, on-chip Memory 256KB
2Real-Time
Processor core
Dual-core ARM Cortex -R5 MPCore up to 533MHZ
E Processor Unit
Memory W/ECC
L1 Cache 32KB l/d per core, Tightly Coupled memory 128KB per core
External Memory
Dynamic Memory Interface
X32/x64: DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 with ECC
Static Memory Interfaces
NAND, 2x Quad-SPl
s Connectivity
High-Speed Connectivity
PCle Gen2 X4, 2X USB3.0, SATA 3. 1, Display Port, 4x Tri-mode Gigabit Ethernet
General Connectivity
2XUSB 2.0, 2X SD/SDIO, 2X UART, 2X CAN 2.0B, 2x 12C, 2x SPL, 4x 32b GPIO
aIntegrated Block
Power Management
Full / Low /PL/ Battery Power domains
RSA. AES, and sha
Functionality
Security
AMS-System Monitor
10-bit, 1MSPS- Temperature and Voltage monitor
PS to PL Interface
12 x 32/ 64/128b AXI Ports
System Logic Cells(K) 103
154
192
256
469
504
600
Programmable
CLB Flip-Flops( K) 94
141
176
234
429
461
548
Functionality
CLB LUTS(K) 47
71
88
117
215
230
274
Max Distributed RAM(Mb) 1.2
1.8
2.6
3.5
6.9
6.2
8.8
eMemory
Total Block RAM(Mb) 5.3
6
4.5
25.1
11.0
32.1
UltraRAM(Mb)
13.5
18.0
27.0
cLocking
Clock Management Tiles(CMTs) 3
4
8
DSP Slices
240
360
728
1,248
1,973
728
2,520
PCI Express Gen 3x16
2
2
E Integrated IP
150G Interlaken
100G Ethernet MAC/PCS W/RS-FEC
AMS-System Monitor
1
1
1
GTH 163Gb/s Transceivers
16
16
24
24
24
Transceivers
GTY 32.75Gb/s Transceivers
Extended(2)
2-2L
Speed grades
Industrial
-1-1L-2
ⅩLINX
Zyngo Ultra Scale+ TM MPSoCs: EG Block Diagram
Processing System
Application Processing Unit
Memory
Graphics Processing Unit
High-Speed
ARM MaliTM-400 MP2
Connectivity
ARM③
NEON TM
Cortex TM-A53
Floating point Uni
DDR4/3/3L
LPDDR4/3
Geometry
Processor
Processor
32/64-Bit W/ECC
I-Cache
D-Cache
agement
W/Parity
W/ECC
Macrocell
256KB OCM
Memory Management Unit
with ecc
G|C-400
SCU
CCUSMMU
1MB L2 W/ECC
64KB L2 Cache
General Connectivity
Real-Time Processing Unit
Platform
Configuration and
System
Vector Floating
Management Unit
Security Unit
Functions
ARM
Point Unit
System
Config aes
CortexTM-R5
Memory protection
Management
Decrypt
Multichannel dma
Authentication
128KB
32KB I-Cache 32KB D-Cache
PoWe
Secure boot
TCM W/ECC
W/ECC
ECC
Management
Voltage/Tem
Timers
Monitor
WDT Resets
Functional
GIC
Clocking debl
Safety
Trustzone
Programmable Logic
High-Speed Connectivity
System Monitor
Interlaken
Storage& Signal Processing
GTH
Block ram
General-Purpose /0
GTY
UltraRAM
High-Performance HP I/O
100G EMAC
DSP
High-Density HD l/0
PCle Gen 3
ⅩLINX
Zynga Ultra Scale+ TM MPSOCS: EG Devices
Device name ZU2Eg ZU3Eg ZU4Eg ZU5Eg ZU6Eg ZU7eg Zu9Eg Zu11EG ZU15EG ZU17EG ZU19EG
Application
Processor core
Quad-core ARM CortexTM-A53 MPCore TM up to 1.5GHZ
Processor unit
Memory W/ECC
L1 Cache 32KB l/d per core, L2 Cache 1MB, on-chip Memory 256KB
Real-Time
Processor core
Dual-core aRm cortex R5 MPCore Tm up to 600MHz
Processor unit
Memory W/ECC
L1 Cache 32KB l /D per core, Tightly Coupled Memory 128KB per core
E Graphic Video
Graphics Processing Unit
MaliTM-400 MP2 up to 667MHZ
t Acceleration
Memory
L2 Cache 64KB
Dynamic memory Interface
x32/x64: DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 with ECC
bo External Memory
Static Memory Interfaces
NAND, 2x Quad-SPI
Connectivity
High-Speed Connectivity
PCle Gen2 x4, 2X USB3.0, SATA 3. 1, Display Port, 4x Tri-mode Gigabit Ethernet
General Connectivity
2XUSB 2.0, 2X SD/SDIO, 2X UART, 2X CAN 2.0B, 2x 12C, 2x SPL, 4x 32b GPIO
Power Management
Integrated block
Full /Low/PL/Battery Power domains
Securit
RSA, AES, and sha
Functionality
AMS-System Monitor
10-bit, 1MSPS-Temperature and voltage monitor
PS to Pl Interface
12 32/ 64/128b AXI Ports
System Logic Cel(K)1031541922564695046006537479261,143
Programmable
Functionality
CLBF| ip-Flops(K)941411762344294615485976828471045
CLB LUTS(K)477188117215230274299341423523
Max Distributed RAM(Mb) 1.2
1.8
2.6
3.5
6.9
6.2
8.8
9.1
11.3
8.0
9.8
Memory
Total block ram(Mb)537.64.55.125111.032121.126.228.0346
UltraRAM(Mb
13.518.0
27.0
22.531.528.736.0
o Clocking
Clock Management Tiles(CMTs)3344
8
4
8
11
DSP Slices2403607281,2481,9731,7282,5202,9283,5281,5901,968
PCI Express gen 3x16
4
E Integrated IP
150G Interlaken
4
100G Ethernet MAC/PCS W/RS-FEC
4
AMS-System Monitor 1
1
GTH 16.3Gb/s Transceivers
16
16
24
24
24
32
24
44
44
Transceivers
GTY 32. 75Gb/s Transceivers
16
28
28
Extended(2) -1-2-2L
-1-2-2L-3
-1-2-2L-3
Speed Grades
Industria
1-1L-2
ⅩLINX
Zynga UltraScalet TM MPSoCs: EV Block Diagram
Processing System
Application Processing Unit
Memory
Graphics Processing Unit
High-Speed
ARM MaliITM-400 MP2
Connectivity
ARM③
NEONTM
CorteXTM-A53
DDR4/3/3L
Geometr
Pixel
Floating point Unit
LPDDR4/3
Processor
Processor
32KB
P
M
Embedded
32/64 bit W/ECC
Cache‖ D-Cache‖ Management
Trace
W/Parity
W/ECC
Unit
Macrocell
256KB OCM
Memory Management Unit
with ecc
G|C-400
SCU‖ CCI/SMMU
1MB L2 W/ECC
64KB L2 Cache
General Connectivity
Real-Time Processing Unit
Platform
Configuration and
System
Vector Floating
Management Unit
Security Unit
Functions
ARM
Point unit
System
Config aes
CorteX TM-R5
Memory Protection
Management
Decryption
Unit
Multichannel dma
authenticate
128KB
32KB I-Cache 32KB D-Cache
Power
Secure Boot
TCM W/ECC
W/ECC
W/ECC
Management
Voltage/Temp
Timers
WDT Resets
Functional
Monitor
GIC
Safety
Clocking Debug
Trustzone
Programmable Logic
System Monito
Storage& Signal Processing
Block rAm
General-Purpose 1/0
High-Speed Connectivity
Video codec
UltraRAM
High-Performance HP 1/0
GTH
H.265H.264
DSP
High-Density HD 70
PCle gen 3
ⅩLINX
Zynga Ultra Scale+ TM MPSoCS: EV Devices
Device name
ZU4EV
ZU5EV
ZU7EV
Application
Processor core
Quad-core ARM CortexTM-A53 MP Core TM up to 1.5GHZ
Processor unit
Memory W/ECC
L1 Cache 32KB l /d per core, L2 Cache 1MB, on-chip Memory 256KB
Real-Time
Processor core
Dual-core ARM Cortex -R5 MPCore TM up to 600MHz
Processor unit
Memory W/ECC
L1 Cache 32KB l /d per core, Tightly Coupled Memory 128KB per core
E Graphic Video
Graphics Processing Unit
MaliTM-400 MP2 up to 667MHz
Acceleration
Memory
L2 Cache 64KB
Dynamic memory Interface
x32/ x64: DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 with ECC
bo External Memory
Static Memory Interfaces
NAND, 2x Quad-SPI
8 Connectivity
High-Speed Connectivity
PCle Gen2 x4, 2X USB3.0, SATA 3. 1, Display Port, 4 Tri-mode gigabit Ethernet
General Connectivity
2XUSB 2.0, 2X SD/SDIO, 2X UART, 2X CAN 2.0B, 2x 12C, 2X SPL, 4x 32b GPIO
Integrated block
Power Management
Full /Low /Pl/Battery Power Domains
RSA, AES, and sha
Functionality
Security
AMS -System Monitor
10-bit, 1MSPS-Temperature and Voltage monitor
PS to PL Interface
12 x 32/64/128b AXI Ports
192
256
504
Programmable
System Logic Cells(K
CLB Flip-Flops(k)
176
234
461
Functionality
CLB LUTS
(K)
88
117
230
Max Distributed RAM(N
2.6
3.5
6.2
Memory
Total Block RAM(Mb
4.5
5.1
11.0
UltraRAM(Mb)
3.5
18.0
27.0
bo Clocking
Clock Management Tiles (cmts)
4
8
DSP Slices
728
1,248
1,728
Video Codec Unit(VCU)
1
PCI Express gen 3x16
2
2
2
E Integrated IP
150G Interlaken
g
100G Ethernet MAC/PCS W/RS-FEC
AMS- System Monitor
1
1
GTH 16.3Gb/s Transceivers
16
16
24
Transceivers
GTY 32.75Gb/s Transceivers
Extended
1-2-2L-3
Speed Grades
Industria
1-1L-2
ⅩLINX
Zynga UItraScale+ TM MPSoCs
PS l/Os(1),3. 3V High-Density(HD)l/0, 1.8V High-Performance(HP)I/Os
PS-GTR 6Gb/s, GTH 163Gb/, GTY 32.75Gb/s
Pkg
Dimensions
Footprint(2,3)(mm)
ZU2
ZU3
ZU4
ZU5
ZUo
ZU7
ZU9
ZU11
ZU15
ZU17
ZU19
170.24,58170.24,58
A484(4)
19X19
4,0,0
4,0,0
A6254)
170,24,156170,24,156
21X21
4,0,0
4,0,0
C78445
21496,156214,96,156214,96,156214,96,156
23x23
4,0,0
4,0.0
4,4,0
4,4,0
B900
31x31
214,48,156214,48,156
21448,156
4,16,0
4,16,0
C900
214,48,156
214,48,156
214,48,156
31X31
4,16,0
4,16,0
4,16,0
B1156
214,120,208
214,120,208
35X35
214,120,208
4,24,0
4,24,0
4,24,0
C1156
214,48,312
214,48,312
35X35
4,20,0
4,20,0
B1517
214,72,416
40X40
214,72,572214,72,572
4,16,0
4,16,0
4,16,0
F1517
214,48,416
40×40
214,48,416
4,24,0
4,32,0
214,96,416214,96,416
C1760
42.5X42.5
214,96,416
4,32,16
4,32,16
4,32,16
214,48,260214,48,260
D1760
42.5×42.5
4,44,284,44,28
45X45
214,96,572214,96,572
E1924
4,44,0
4,44,0
Important:Verifyalldatainthisdocumentwiththedevicedatasheetsfoundatwww.xilinx.com
E XILINX
Zynga Ultra Scale+ TM MPSoc
The Zyng Ultra Scale+ family provides footprint compatibility to enable users to migrate designs from one device to
another any two packages with the same footprint identifier code(last letter and number sequence) are footprint
compatible
UltraScale+ TM
ⅩLINX
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