usb3.2协议最新的USB3.2协议，涉及协议概况等，方便大家参考学习Revision 1.o U

文件名称: usb3.2协议

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详细说明：最新的USB3.2协议，涉及协议概况等，方便大家参考学习Revision 1.o Universal serial bus 3.2 September 22, 2017 Specification Acknowledgement of technical contributio Dedication Dedicated to the memory of brad hosler the impact of whose lish de the universal serial bus one of th successful technology innovations of the Personal Computer era The authors of this specification would like to recognize the following people who participated in the usB 3.2 Bus Specification technical work group. We would also like to acknowledge the many unnamed others throughout the industry who provided feedba ck and contributed to the development of this specification Apple Inc -Promoter Company Employees Sree anantharaman Brian back Jason Chung David Conroy Bill cornelius Scott deandrea William Ferry Rhoads hollowell Derek iwamoto Scott Jackson Reese schreiber ennifer tsal Colin Whitby - Strevens Jeff Wilcox Dan wilson Hewlett-Packard Inc -Promoter Company Employees Alan berkema Norton ewart Rahul lakdawal Intel Corporation- Promoter Company Employees Huimin chen Kuan- Yu Chen John crouter Benjamin graniello Raul gutierrez Howard heck Danny Hofshi John Howard Rahman ismail James jaussi Vijaykumar Kagi Issy Kipi Ley kolomiets Christine krause Yun Ling Viji ramachandran Kaleb ruot Zees han sarwar Brad saunders Sarah sharp Amit srivastava Shankar subramani David Thompson Karthi vadivelu Microsoft Corporation - Promoter Company Employees Randy aull Anthony chen Vivek gupta Robbie harris Jayson Kastens Toby nixon Rahul ramadas Yang you Renesas Corporation- Promoter Company Employees Tam do Bob dunstan Masami Katagiri Philip leung Kiichi mute aLme Noza STMicroelectronics - Promoter Company Employees Jerome deroo Abdelaziz goulahsen Benoit mercier Richard o connor Texas Instruments- Promoter Company Employees Mike campbell Grant Ley Anwar sadat James skidmore Sue vining Contributor Company Employees Aces electronics co, Jason chen Andy Feng Ltd Acon Glen Chandler Vicky Chuang Sharon hsiao Advanced micro devices Shadi barakat Walter Fry Will harr Jason haw ken Yufei ma Joseph Scanlon Peter Teng Vishant Tyag Min Wang Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o -v- Universal serial bus 3.2 September 22, 2017 pecification Allion labs, inc Howard chang John lin Stan lin Brian shih Analogix Ke ma Greg Stewart Haijian Sui Semiconductor, inc. ASMedia technology Chin chang Weber chuang Inc n Sung kue ng Sheng Chung Wu Bizlink Technology, Inc. Ted Hsiao Morphy hsieh Sean o neal Cadence Design Harisankar arcin behrendt Huzaifa dalal Systems, Inc. Aravindakshan Jacek duda Pawel eichler Dariusz kaczmarczy k Tomasz klimek John Lupiens ki Uyen nguyen Raja pounraj Fred stivers Claire ying Corning optical Wojciech Giziewicz Ian Mckay Jamie Silva Communications llc Cosemi Technologies Samir des ai Devang Parekh Cypress Semiconductor Mark Fu ushil kadakia Michael miskho nup naya Veerappa Rangaraj Sundaravaradan Dell inc Mohammed hijazi Terry Matula Marcin nowak Sean c′Neal Merle we Diodes Incorporated Kay annamalai Joseph Juan Qun Song Jin-sheng Wang Michael zhang Display Link (UK)Ltd. Pete burgers Dan ellis Electronics Testing Sophia liu Center. taiwa Abel Astley Rick bogart Mario Pasquali Chuck trefts EverPro Technologies Jiang hui Tom Yang Company, Ltd FLIR Integrated Imaging Andrew Fussell Damian nesbitt Tim vlaar Soluti Foxconn/Hon Hai Fred fons Bob hall Terry little g Lou Fresco logic Inc Tim barilovits Bob mcvay Christopher Meyers le Granite river labs Mike Engebretson Hirose electric Junya doi Kazu ichikawa Daisuke Kogure William kysiak Clement luk William MacKillop Tadashi ohshid a Isamu saito Toshiyuki Takada Sid te Japan Aviation Toshiyuki Moritake Takeharu naito Mark s Electronics Industry Toshio shimoyama Takamitsu wada Ltd OAeI JMicron Technology Charon chen Kevin liu Hung-Cheng Lo Corp Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o Universal serial bus 3.2 September 22, 2017 Specification Keysight Technologies Biing- Lin Lem Jit Li Pedro merlo Roland scherzinger Doy Yancy Le Croy Corporation Linden hsu Daniel H Jacobs Tyler Joe Mike micheletti Michael roun Chris webb Lenovo Tomoki harada LG Electronics inc Do Kyun kim Lotes co, ltd Ariel Delos reyes Regina Liu-llwang ohn lynch LSI Corporation Harvey Newman Dave Thompson Srinivas vura Luxshare-ICT Josue castillo Sally chiu Alan Winningham Stone lin Scott shuey James stevens MEC IMEX INC -HPT Daniel chen Mega Chips Corporation Satoru Kumashiro Microchip Technology Mark bohm Mick davis Adriaan peeters Richard petrie Andrew rogers Mouli subramanian MQP Electronics Ltd Sten carlsen nokia Peter harrison NXP Semiconductors Jason chen Gerrit den besten Anand kannan Vijendra Kuro ishan tn Bart vertentes Ahmad yazdi ON Semiconductor Eduardo de re Parade technologies Craig Wiley Qualcomm, Inc. James goel Karyn Vuong Jin-sheng wang Realtek Semiconductor Terry Lin or Samsung electronics Cheolyoon Chung Jagoun Koo Cheolho lee Co, Ltd Jun Bum L Seagate Technology llc Alvin Cox Steven davis Emmanuel Lemay Michael morgan Dan smith Cuong tran Philip yi Shenzhen deren Smark huo Lucy zhang Electronics co, ltd Sibridge Technologies Bhavesh Desa Chirag dhruv Dipak modi Kruti shah Mis hith shukla pecwertz Amanda hosler Synopsys, Inc. Subramaniam aravindhan Chan drashekar b u Bala babu Morton christiansen Gervais fong Kevin heilman Eric huang Behram minwalla Saleem mohammad Matthew myers Tri nguyen John Stonick Zon Wen Tektronix, inc Sarah boen Keyur Diwan Srikrishna nh Joshua obrien Total phase Chris Yokum James mason Egbert stellinga Noah zhang Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o Universal serial bus 3.2 September 22, 2017 Specification Tyco Electronics Corp . a te connectivity ltd company VIA Technologies, Inc. Kent chen Ray man chiu Ron liu (including VIA Labs, Terran ce Shih Jay tseng Wayne tseng Fong-Ji Western Digital Marvin de forest Larry mcmillan Charles neumann Branded Cristian roman del nido curtis steven Xiaomi Communications Xiaoxing Yang Juejia zhou Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o Universal serial bus 3.2 September 22, 2017 Specification Contents 1 Introduction ::::::::::.::::::::::::::::::::::::: 1.1 Background 着1 1.2 Objective of the e specificati 1.3 Scope of the document :a::a:::a:2a1:: 1.4 USB Product Compliance 1.5 Document organization…… 1.6 Design Goals 1.7 Related documents 1.8 Conventions 1.8.1 Precedence 2223333 1.8.2 Keywords 1.8.2.1 Informative 着1重1正 1.8.2.2 May 18.2.3N/A. 18. 2. 4 Normative 4 1.8.2.5 Optional 重重11目道 1,国,1道重 ……4 1.8.2.6 Reservec.… 18.2 Shall 4 1.8.2, 8 Should 1.8.2.9 Numbering… 2 Terms and abbreviations 3 Architectural overview ::::::::a:::::.::::::::::a::::::::::::::::::::::::a:: …15 3.1 USB 3.2 System Description 15 3.11 usb.2 Mechanical 17 3.1.2 usb32 Power 17 3.1.3 USB 3.2 System Configuration ,17 3.1.4 Architectural differences between usb32 and usb 2.0 ..17 3.2 Enhanced SuperSpeed Bus Architecture 18 3.2.1 Physical layer 20 3.2.1.1 Gen 1 Physical Layer. 21 3.2.1.2 Gen 2 Physical Layer 21 3.2.1.3 Dual-Lane Operation 22 3.2.2 Link l 22 32.3 Protocol Layer…… 23 3.2.3.1 Super Speed Protocol 24 32.3.2 SuperSpeedPlus Protocol.,.,.,…,… 24 3.2.4 Robus tness 24 3.2.4.1 Error detection .25 Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o v Universal serial bus 3.2 September 22, 2017 Specification 3. 2.4.2 Error handling 32.5 Enhanced SuperSpeed power management…… .25 3.2.6 Devices 26 3.2.6.1 Peripheral Devices 3.2.6.2HubS. 28 3.2.7 Hosts 30 33 Enhanced SuperSpeed Bus Data Flow models……………………………31 Enhanced SuperSpeed Data Flow Model 32 4.1 Implementer viewpoints 32 2 Enhanced SuperSpeed Communication Flow ..32 42.1 Pipes… 32 4.3 Enhanced SuperSpeed protocol overview.. 33 43.1 Differences from usb 2.0 33 4.3.1.1 Comparing UsB 2.0 and enhanced SuperSpeed Transactions ....34 4.3.1.2 Introduction to Enhanced Super Speed Packets 34 4.4 Generalized transfer description ::::: 1,1,重,重 35 4.4.1 Data Bursting 36 4.4.2 IN Transfers,…… 1国 36 4, 43 oUt Transfers 37 44.4 Power Management and Performance………… a:::: 38 4. 4.5 Control transfers 39 4.4.5.1 Control transfer packet size 39 4.4.5.2 Control Transfer Bandwidth requirements 39 4. 4.5.3 Control Transfer Data Sequences 40 4 4.6 Bulk Transfers 国1国国11,面,111111 40 4.4.6.1 Bulk Transfer data packet size 40 4.4.6.2 Bulk Transfer Bandwidth Requirements 4.4.6.3 Bulk Transfer data Sequences 41 4, 4.64 Bulk streams 41 4.4.7 Interrupt Transfers 43 4.4.7. 1 Interrupt Transfer Packet Size 44 4. 4.7.2 Interrupt Transfer Bandwidth Requirements 44 4.4.7.3 Interrupt Transfer Data Sequences 45 4.48 Isochronous transfers 45 448.1 Isochronous transfer packet size 1道1国面面1 …46 4. 4.8.2 Isochronous Transfer Bandwidth Requirements. m...mm.mm.m.m.m..m.m..46 4. 4.8.3 Isochronous Transfer Data Sequences 47 4.4.8.4 Special Considerations for Isochronous Transfers 47 4 4.9 Device notifications 49 4,410 Reliabilit 49 Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o Universal serial bus 3.2 September 22, 2017 Specification 4. 4.10.1 Physical Layer. 49 4. 4.10.2 Link Layer 49 44.10.3 Protocol Layer…… 在1 …149 4.4.11 Efficiency. :::::: 49 5 Mechanical 50 6 Physical Layer…… .51 6. 1 Physical layer overview 51 6.2 Physical layer functions ……51 6,2.1 Measurement0 vervet.……….55 6.2.2 Channel overview 56 63 Sym bol encoding… 56 6.3.1 Gen 1 Encoding.... :.. .56 6.3, 1.1 Serialization and deserialization of data 57 6.3.1.2 Normative 8b/10b Decode Rules for Gen 1 Operation 57 6.3. 1.3 Gen 1 Data Scrambling 58 6.3.1.4 8b/10b Decode Errors for Gen 1 Operation 59 6.3.2 Gen 2 Encoding 59 6.3.2.1 Serialization and deserialization of data 59 6.3.2.2 Normative 128b/132b Decode rules 60 6.3.2.3 Data Scrambling for Gen 2 Operation .60 6.3.2. 4 128b/132b Decode errors................63 6.3.3 Special Sy m bols for Framing and Link management 63 6.4 Link Initialization and Training ,64 64.1 Lin k training………………………………64 6.4.1.1 Gen 1 Operation 64 6.4.1.2 Gen 2 Operation 67 6.4.2 Lane polarity Inversion 70 6. 4.2.1 Gen 1 Operation 70 6.4.2.2 Gen 2 Operation 70 6.4.3 Elasticity Buffer and sKp Ordered set 70 6.4.3.1 SKP Rules(Host/Device/Hub] for Gen 1x1 Operation 6.4.3.2 SKP Rules (host/ Device/Hub for Gen 1x2 Operation.........71 6.4.3.3 SKP Rules(HostDevice/Hub] for Gen 2 Operation 71 6.4.4 Compliance Pattern 73 6.4.4.1 Gen 2 Compliance Pattern Cpg 74 6.5 Clock and jitter…. 74 6.5.1 Informative itter Budgeting.…… 74 6.5.2 Normative Clock Recovery Function 75 63 Normative Spread Spectrum Clocking〔SSC)…… 77 6.5. 4 Normative slew rate limit 78 Copyright c 2017 USB 3.0 Promoter Group. All rights reserved Revision 1.o Universal serial bus 3.2 September 22, 2017 Specification 6.5.5 Reference Clock Requirements 78 6.6 Signal 79 6.6.1 Eye Diagrams………………… 79 6.6.2 Voltage level definitic 80 6.6.3 Tx and rx input parasitics 81 6.7 Transmitter Specifications 重1,1着重 1,1重 ,81 6.7.1 Transmitter electrical parameters,……….81 6.7.2 Low Power transmitter ,83 6.7.3 Transmitter Eye 84 6.7.4 TX Compliance reference receiver equalizer function 85 6.7.5 Transmitter De-emphas 85 6.7.5.1Gen1(5GT/seC)……,, 在1 ….85 6.7.5.2Gen2(10GT/sec) ..86 6.7.6 Entry into Electrical Idle, u1 89 6.8 Receiver specifications…..….….89 6.8.1 Receiver Equalization Training 89 6.8.2 Informative receiver ctle function 90 6.8.2.1Gen1 Reference ctle.……… 90 6.8.2.2 Gen 2 Reference equalizer function 91 6.8.3 Receiver electrical parameters 93 6.8.4 Receiver Loopback 95 6.8.4.1 Loopback bert for gen 1 Operation .95 6.8.5 Normative Receiver tolerance compliance test 96 6.9 Low Frequency Periodic Signaling (LFPS) 98 6.91 LFPS Signal definition……, 98 6.9.2 Example LfPS Handshake for U 1/U2 Exit, Loopback Exit, and U3 Wakeup…… 100 6.9.3 Warm reset 103 6.9.4 Super Speed Plus Capability Declaration .103 6.9.4.1 Binary representation of Polling, LFPs...... 103 6.9.4.2 SCD1/SCD2 Definition and Transmission 104 695 SuperSpeed Plus LFPS Based PWM Message(LBPM…………105 6951 Introduction to LFPS Based PWM Signaling ( lBps)………,105 6.9.5.2 LBPM Definition and transmission…………106 6.10 Transmitter and receiver dc specifications 107 6.10.1 Informative esd protection 107 6.10.2 Informative Short Circuit Requirements 6.10.3 Normative High Impedance reflections 107 6.11 Receiver detection ……107 6.11.1 Rx Detect overview 107 6.11.2 RX Detect Sequence 108 6.11.3 Upper Limit on Channel Capacitance 109 Copyright c 2017 USB 3.0 Promoter Group. 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