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Printed Circuits Handbook
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上传时间: 2010-04-24
详细说明： 印刷电路板手册第六版 Part 1 Lead-Free Legislation Chapter 1. Legislation and Impact on Printed Circuits 1.3 1.1 Legislation Overview / 1.3 1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3 1.3 Restriction of Hazardous Substances (RoHS) / 1.3 1.4 RoHS’ Impact on the Printed Circuit Industry / 1.6 1.5 Lead-Free perspecives / 1.10 1.6 Other Legislative Initiatives / 1.10 Part 2 Printed Circuit Technology Drivers Chapter 2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY 2.3 2.1 Introduction / 2.3 2.2 Measuring the Interconn ectivity Revolution (HDI) / 2.3 2.3 Hierarchy of Interconnections / 2.6 2.4 Factors Affecting Selection of Interconnections / 2.7 2.5 ICS and Packages / 2.10 2.6 Density Evaluations / 2.14 2.7 Methods to Increase PWB Density / 2.16 References / 2.21 Chapter 3. Semiconductor Packaging Technology 3.1 3.1 Introduction / 3.1 3.2 Single-Chip Packaging / 3.5 3.3 Multichip Packages / 3.15 3.4 Optical Interconnects / 3.18 3.5 High-Density/High-Performance Packaging Summary / 3.21 3.6 Roadmap Information / 3.21 References / 3.21 Chapter 4. Advanced Component Packaging 4.1 4.1 Introduction / 4.1 4.2 Lead-Free / 4.2 4.3 System-on-a-Chip (SOC) versus System-on-a-Package (SOP) / 4.3 v For more information about this title, click here 4.4 Multichip Modules / 4.5 4.5 Multichip Packaging / 4.6 4.6 Enabling Technologies / 4.10 4.7 Acknowledgment / 4.18 References / 4.18 Chapter 5. Types of Printed Wiring Boards 5.1 5.1 Introduction / 5.1 5.2 Classification of Printed Wiring Boards / 5.1 5.3 Organic and Nonorganic Substrates / 5.3 5.4 Graphical and Discrete-Wire Boards / 5.3 5.5 Rigid and Flexible Boards / 5.5 5.6 Graphically Produced Boards / 5.6 5.7 Molded Interconnection Devices / 5.10 5.8 Plated-Through-Hole (PTH) Technologies / 5.10 5.9 Summary / 5.13 References / 5.14 Part 3 Materials Chapter 6. Introduction to Base Materials 6.3 6.1 Introduction / 6.1 6.2 Grades and Specifications / 6.3 6.3 Properties Used to Classify Base Materials / 6.9 6.4 Types of FR-4 / 6.13 6.5 Laminate Identification Scheme / 6.14 6.6 Prepreg Identification Scheme / 6.18 6.7 Laminate and Prepreg Manufacturing Processes / 6.18 References / 6.24 Chapter 7. Base Material Components 7.1 7.1 Introduction / 7.1 7.2 Epoxy Resin Systems / 7.1 7.3 Other Resin Systems / 7.5 7.4 Additives / 7.7 7.5 Reinforcements / 7.12 7.6 Conductive Materials / 7.18 References / 7.25 Chapter 8. Properties of Base Materials 8.1 8.1 Introduction / 8.1 8.2 Thermal, Physical, and Mechanical Properties / 8.1 8.3 Electrical Properties / 8.13 References / 8.16 Chapter 9. Base Materials Performance Issues 9.1 9.1 Introduction / 9.1 9.2 Methods of Increasing Circuit Density / 9.2 9.3 Copper foil / 9.2 9.4 Laminate Constructions / 9.7 9.5 Prepreg Options and Yield-Per-Ply Values / 9.9 vi CONTENTS 9.6 Dimensional Stability / 9.10 9.7 High-Density Interconnect/Microvia Materials / 9.13 9.8 CAF Growth / 9.15 9.9 Electrical Performance / 9.22 References / 9.33 Chapter 10. The Impact of Lead-Free Assembly on Base Materials 10.1 10.1 Introduction / 10.1 10.2 RoHS Basics / 10.1 10.3 Base Material Compatibility Issues / 10.2 10.4 The Impact of Lead-Free Assembly on Base Material Components / 10.4 10.5 Critical Base Material Properties / 10.4 10.6 Impact on Printed Circuit Reliability and Material Selection / 10.18 10.7 Summary / 10.21 References / 10.22 Chapter 11. Selecting Base Materials for Lead-Free Assembly Applications 11.1 11.1 Introduction / 11.1 11.2 Pcb fabrication and Assembly Interactions / 11.1 11.3 Selecting the Right Base Material for Specific Application / 11.6 11.4 Example Application of this Tool / 11.14 11.5 Discussion of the Range of Peak Temperatures for Lead-Free Assembly / 11.15 11.6 Lead-Free Applications and Ipc-4101 Specification Sheets / 11.15 11.7 Additional Base material Options for Lead-Free Applications / 11.16 11.8 Summary / 11.17 References / 11.18 Chapter 12. Laminate Qualification and Testing 12.1 12.1 Introduction / 12.1 12.2 Industry Standards / 12.2 12.3 Laminate Test Strategy / 12.4 12.4 Initial Tests / 12.5 12.5 Full Material Characterization / 12.9 12.6 Characterization Test Plan / 12.22 12.7 Manufacturability in the Shop / 12.23 Part 4 Engineering and Design Chapter 13. Physical Characteristics of the PCB 13.3 13.1 Classes of PCB Designs / 13.3 13.2 Types of PCBs or Packages for Electronic Circuits / 13.9 13.3 Methods of Attaching Components / 13.14 13.4 Component Package Types / 13.15 13.5 Materials Choices / 13.18 13.6 Fabrication Methods / 13.22 13.7 Choosing a Package Type and Fabrication Vendor / 13.24 Chapter 14. The PCB Design Process 14.1 14.1 Objective of the PCB Design Process / 14.1 14.2 Design Processes / 14.1 CONTENTS vii 14.3 Design Tools / 14.6 14.4 Selecting a Set of Design Tools / 14.10 14.5 Interfacing Cae, Cad, and CAMTools to Each Other / 14.11 14.6 Inputs to the Design Process / 14.11 Chapter 15. Electrical and Mechanical Design Parameters 15.1 15.1 Printed Circuit Design Requirements / 15.1 15.2 Introduction to Electrical Signal Integrity / 15.1 15.3 Introduction to Electromagnetic Compatibility / 15.3 15.4 Noise Budget / 15.4 15.5 Designing for Signal Integrity and Electromagnetic Compatibility / 15.4 15.6 Mechanical Design Requirements / 15.9 References / 15.17 Chapter 16. Current Carrying Capacity in Printed Circuits 16.1 16.1 Introduction / 16.1 16.2 Conductor (Trace) Sizing Charts / 16.1 16.3 Current Carrying Capacity / 16.2 16.4 Charts / 16.6 16.5 Baseline Charts / 16.10 16.6 Odd-Shaped Geometries and the “Swiss Cheese” Effect / 16.19 16.7 Copper Thickness / 16.20 References / 16.21 Chapter 17. PCB Design for Thermal Performance 17.1 17.1 Introduction / 17.1 17.2 The PCB as a Heat Sink Soldered to the Component / 17.2 17.3 Optimizing the PCB for Thermal Performance / 17.3 17.4 Conducting Heat to the Chassis / 17.12 17.5 PCB Requirements for High-Power Heat Sink Attach / 17.14 17.6 Modeling the Thermal Performance of the PCB / 17.15 References / 17.18 Chapter 18. Information Formating and Exchange 18.1 18.1 Introduction to Data Exchange / 18.1 18.2 The Data Exchange Process / 18.3 18.3 Data Exchange Formats / 18.9 18.4 Drivers for Evolution / 18.22 18.5 Acknowledgment / 18.23 References / 18.23 Chapter 19. Planning for Design, Fabrication, and Assembly 19.1 19.1 Introduction / 19.1 19.2 General Considerations / 19.3 19.3 New Product Design / 19.4 19.4 Layout Trade-off Planning / 19.10 19.5 PWB Fabrication Trade-off Planning / 19.17 19.6 Assembly Trade-Off Planning / 19.24 References / 19.27 viii CONTENTS Chapter 20. Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly 20.1 20.1 Introduction / 20.1 20.2 Manufacturing Information / 20.2 20.3 Initial Design Review / 20.7 20.4 Design Input / 20.15 20.5 Design Analysis and Review / 20.19 20.6 The CAM-Tooling Process / 20.19 20.7 Additional Processes / 20.31 20.8 Acknowledgment / 20.32 Chapter 21. Embedded Components 21.1 21.1 Introduction / 21.1 21.2 Definitions and Example / 21.1 21.3 Applications and Trade-Offs / 21.2 21.4 Designing for Embedded Component Applications / 21.3 21.5 Materials / 21.6 21.6 Material Supply Types / 21.9 Part 5 High Density Interconnection Chapter 22. Introduction to High-Density Interconnection (HDI) Technology 22.3 22.1 Introduction / 22.3 22.2 Definitions / 22.3 22.3 HDI Structures / 22.7 22.4 Design / 22.11 22.5 Dielectric Materials and Coating Methods / 22.13 22.6 HDI Manufacturing Processes / 22.26 References / 22.34 Bibliography-Additional Reading / 22.35 Chapter 23. Advanced High-Density Interconnection (HDI) Technologies 23.1 23.1 Introduction / 23.1 23.2 Definitions of HDI Process Factors / 23.1 23.3 HDI Fabrication Processes / 23.3 23.4 Next-Generation HDI Processes / 23.33 References 23.37 Part 6 Fabrication Chapter 24. Drilling Processes 24.3 24.1 Introduction / 24.3 24.2 Materials / 24.4 24.3 Machines / 24.11 24.4 Methods / 24.15 24.5 Hole Quality / 24.18 24.6 Postdrilling Inspection / 24.20 24.7 Drilling Cost Per Hole / 24.20 CONTENTS ix Chapter 25. Precision Interconnect Drilling 25.1 25.1 Introduction / 25.1 25.2 Factors Affecting High-Density Drilling / 25.1 25.3 Laser versus Mechanical / 25.2 25.4 Factors Affecting High-Density Drilling / 25.5 25.5 Depth-Controlled Drilling Methods / 25.10 25.6 High-Aspect-Ratio Drilling / 25.10 25.7 Innerlayer Inspection of Multilayer Boards / 25.13 Chapter 26. Imaging 26.1 26.1 Introduction / 26.1 26.2 Photosensitive Materials / 26.2 26.3 Dry-Film Resists / 26.4 26.4 Liquid Photoresists / 26.7 26.5 Electrophoretic Depositable Photoresists / 26.8 26.6 Resist Processing / 26.8 26.7 Design for Manufacturing / 26.27 References / 26.29 Chapter 27. Multilayer Materials and Processing 27.1 27.1 Introduction / 27.1 27.2 Printed Wiring Board Materials / 27.2 27.3 Multilayer Construction Types / 27.16 27.4 ML-PWB Processing and Flows / 27.37 27.5 Lamination Process / 27.51 27.6 Lamination Process Control and Troubleshooting / 27.59 27.7 Lamination Overview / 27.63 27.8 ML-PWB Summary / 27.63 References / 27.63 Chapter 28. Preparing Boards for Plating 28.1 28.1 Introduction / 28.1 28.2 Process Decisions / 28.1 28.3 Process Feedwater / 28.3 28.4 Multilayer PTH Preprocessing / 28.4 28.5 Electroless Copper / 28.8 28.6 Acknowledgment / 28.11 References / 28.11 Chapter 29. Electroplating 29.1 29.1 Introduction / 29.1 29.2 Electroplating Basics / 29.1 29.3 High-Aspect Ratio Hole and Microvia Plating / 29.2 29.4 Horizontal Electroplating / 29.4 29.5 Copper Electroplating General Issues / 29.6 29.6 Acid Copper Sulfate Solutions and Operation / 29.14 29.7 Solder (Tin-Lead) Electroplating / 29.19 29.8 Tin Electroplating / 29.21 29.9 Nickel Electroplating / 29.23 29.10 Gold Electroplating / 29.25 29.11 Platinum Metals / 29.28 29.12 Silver Electroplating / 29.29 x CONTENTS 29.13 Laboratory Process control / 29.29 29.14 Acknowledgment / 29.31 References / 29.31 Chapter 30. Direct Plating 30.1 30.1 Direct Metallization Technology / 30.1 References / 30.11 Chapter 31. PWB Manufacture Using Fully Electroless Copper 31.1 31.1 Fully Electroless Plating / 31.1 31.2 The Additive Process and its Variations / 31.2 31.3 Pattern-Plating Additive / 31.2 31.4 Panel-Plate Additive / 31.7 31.5 Partly Additive / 31.8 31.6 Chemistry of Electroless Plating / 31.9 31.7 Fully Electroless Plating Issues / 31.12 References / 31.14 Chapter 32. Printed Circuit Board Surface Finishes 32.1 32.1 Introduction / 32.1 32.2 Alternative Finishes / 32.3 32.3 Hot Air Solder Level (Hasl or Hal) / 32.4 32.4 Electroless Nickel Immersion Gold (ENIG) / 32.6 32.5 Organic Solderability Preservative (OSP) / 32.8 32.6 Immersion Silver / 32.10 32.7 Immersion Tin / 32.11 32.8 Other Surface Finishes / 32.13 32.9 Assembly Compatibility / 32.14 32.10 Reliability Test Methods / 32.17 32.11 Special Topics / 32.18 32.12 Failure Modes / 32.19 32.13 Comparing Surface Finish Properties / 32.23 References / 32.23 Chapter 33. Solder Mask 33.1 33.1 Introduction / 33.1 33.2 Trends and Challenges for Solder Mask / 33.2 33.3 Types of Solder Mask / 33.3 33.4 Solder Mask Selection / 33.4 33.5 Solder Mask Application and Processing / 33.9 33.6 VIA Protection / 33.18 33.7 Solder Mask Final Properties / 33.19 33.8 Legend and Marking (Nomenclature) / 33.19 Chapter 34. Etching Process and Technologies 34.1 34.1 Introduction / 34.1 34.2 General Etching Considerations and Procedures / 34.2 34.3 Resist Removal / 34.4 34.4 Etching Solutions / 34.6 34.5 Other Materials for Board Construction / 34.18 34.6 Metals Other than Copper / 34.19 34.7 Basics of Etched Line Formation / 34.20 CONTENTS xi 34.8 Equipment and Techniques / 34.26 References / 34.29 Chapter 35. Machining and Routing 35.1 35.1 Introduction / 35.1 35.2 Punching Holes (Piercing) / 35.1 35.3 Blanking, Shearing, and Cutting of Copper-Clad Laminates / 35.3 35.4 Routing / 35.6 35.5 Scoring / 35.13 35.6 Acknowledgment / 35.15 Part 7 Bare Board Test Chapter 36. Bare Board Test Objectives and Definitions 36.3 36.1 Introduction / 36.3 36.2 The Impact of HDI / 36.3 36.3 Why Test? / 36.4 36.4 Circuit Board Faults / 36.6 Chapter 37. Bare Board Test Methods 37.1 37.1 Introduction / 37.1 37.2 Nonelectrical Testing Methods / 37.1 37.3 Basic Electrical Testing Methods / 37.2 37.4 Specialized Electrical Testing Methods / 37.9 37.5 Data and Fixture Preparation / 37.13 37.6 Combined Testing Methods / 37.20 Chapter 38. Bare Board Test Equipment 38.1 38.1 Introduction / 38.1 38.2 System Alternatives / 38.1 38.3 Universal Grid Systems / 38.3 38.4 Flying-Probe/Moving-Probe Test Systems / 38.17 38.5 Verification and Repair / 38.21 38.6 Test Department Planning and Management / 38.22 Chapter 39. HDI Bare Board Special Testing Methods 39.1 39.1 Introduction / 39.1 39.2 Fine-Pitch Tilt-Pin Fixtures / 39.2 39.3 Bending Beam Fixtures / 39.3 39.4 Flying Probe / 39.3 39.5 Coupled Plate / 39.3 39.6 Shorting Plate / 39.4 39.7 Conductive Rubber Fixtures / 39.5 39.8 Optical Inspection / 39.5 39.9 Noncontact Test Methods / 39.5 39.10 Combinational Test Methods / 39.7 xii CONTENTS Part 8 Assembly Chapter 40. Assembly Processes 40.3 40.1 Introduction / 40.3 40.2 Through-Hole Technology / 40.5 40.3 Surface-Mount Technology / 40.16 40.4 Odd-Form Component Assembly / 40.42 40.5 Process Control / 40.48 40.6 Process Equipment Selection / 40.54 40.7 Repair and Rework / 40.57 40.8 Conformal Coating, Encapsulation, and Underfill Materials / 40.64 40.9 Acknowledgment / 40.66 Chapter 41. Conformal Coating 41.1 41.1 Introduction / 41.1 41.2 Types of Conformal Coatings / 41.3 41.3 Product Preparation / 41.6 41.4 Application Processes / 41.7 41.5 Cure, Inspection, and Finishing / 41.11 41.6 Repair Methods / 41.13 41.7 Design for Conformal Coating / 41.14 References / 41.17 Part 9 Solderability Technology Chapter 42. Solderability: Incoming Inspection and Wet Balance Technique 42.3 42.1 Introduction / 42.3 42.2 Solderability / 42.4 42.3 Solderability Testing—a Scientific Approach / 42.8 42.4 The Influence of Temperature on Test Results / 42.13 42.5 Interpreting the Results:Wetting Balance Solderability Testing / 42.14 42.6 Globule Testing / 42.15 42.7 PCB Surface Finishes and Solderability Testing / 42.16 42.8 Component Solderability / 42.22 Chapter 43. Fluxes and Cleaning 43.1 43.1 Introduction / 43.1 43.2 Assembly Process / 43.2 43.3 Surface Finishes / 43.3 43.4 Soldering Flux / 43.5 43.5 Flux Form Versus Soldering Process / 43.6 43.6 Rosin Flux / 43.7 43.7 Water-Soluble Flux / 43.8 43.8 Low Solids Flux / 43.9 43.9 Cleaning Issues / 43.10 43.10 Summary / 43.12 References / 43.12 CONTENTS xiii Part 10 Solder Materials and Processes Chapter 44. Soldering Fundamentals 44.3 44.1 Introduction / 44.3 44.2 Elements of a Solder Joint / 44.4 44.3 The Solder Connection to the Circuit Board / 44.4 44.4 The solder Connection to the Electrical Component / 44.5 44.5 Common Metal-Joining Methods / 44.5 44.6 Solder Overview / 44.9 44.7 Soldering Basics / 44.9 Chapter 45. Soldering Materials and Metallurgy 45.1 45.1 Introduction / 45.1 45.2 Solders / 45.2 45.3 Solder Alloys and Corrosion / 45.4 45.4 PB-Free Solders: Search for Alternatives and Implications / 45.5 45.5 PB-Free Elemental Alloy Candidates / 45.5 45.6 Board Surface Finishes / 45.11 References / 45.19 Chapter 46. Solder Fluxes 46.1 46.1 Introduction to Fluxes / 46.1 46.2 Flux Activity and Attributes / 46.2 46.3 Flux: Ideal Versus Reality / 46.3 46.4 Flux Types / 46.4 46.5 Water-Clean (Aqueous) Fluxes / 46.4 46.6 No-Clean Flux / 46.7 46.7 Other Fluxing Caveats / 46.9 46.8 Soldering Atmospheres / 46.12 References / 46.15 Chapter 47. Soldering Techniques 47.1 47.1 Introduction / 47.1 47.2 Mass Soldering Methods / 47.1 47.3 Oven Reflow Soldering / 47.1 47.4 Wave Soldering / 47.28 47.5 Wave Solder Defects / 47.39 47.6 Vapor-Phase Reflow Soldering / 47.42 47.7 Laser Reflow Soldering / 47.43 47.8 Tooling and the Need for Coplanarity and Intimate Contact / 47.50 47.9 Additional Information Sources / 47.53 47.10 Hot-Bar Soldering / 47.53 47.11 Hot-Gas Soldering / 47.58 47.12 Ultrasonic Soldering / 47.59 References / 47.61 Chapter 48. Soldering Repair and Rework 48.1 48.1 Introduction / 48.1 48.2 Hot-Gas Repair / 48.1 xiv CONTENTS 48.3 Manual Solder Fountain / 48.5 48.4 Automated Solder Fountain / 48.6 48.5 Laser / 48.6 48.6 Considerations for Repair / 48.6 Reference / 48.7 Part 11 Nonsolder Interconnection Chapter 49. Press-Fit Interconnection 49.3 49.1 Introduction / 49.3 49.2 The Rise of Press-Fit Technology / 49.3 49.3 Compliant Pin Configurations / 49.4 49.4 Press-Fit Considerations / 49.6 49.5 Press-Fit Pin Materials / 49.7 49.6 Surface Finishes and Effects / 49.8 49.7 Equipment / 49.10 49.8 Assembly Process / 49.11 49.9 Press Routines / 49.12 49.10 PWB Design and Board Procurement Tips / 49.14 49.11 Press-Fit Process Tips / 49.15 49.12 Inspection and Testing / 49.16 49.13 Soldering and Press-Fit Pins / 49.17 References / 49.17 Chapter 50. Land Grid Array Interconnect 50.1 50.1 Introduction / 50.1 50.2 LGA and the Environment / 50.1 50.3 Elements of the LGA System / 50.2 50.4 Assembly / 50.5 50.5 Printed Circuit Assembly (PCA) Rework / 50.7 50.6 Design Guidelines / 50.8 Reference / 50.8 Part 12 Quality Chapter 51. Acceptability and Quality of Fabricated Boards 51.3 51.1 Introduction / 51.3 51.2 Specific Quality and Acceptability Criteria by PCB Type / 51.4 51.3 Methods for Verification of Acceptability / 51.6 51.4 Inspection Lot Formation / 51.7 51.5 Inspections Categories / 51.8 51.6 Acceptability and Quality After Simulated Solder Cycle(s) / 51.8 51.7 Nonconforming PCBS and Material Review Board (MRB) Function / 51.10 51.8 The Cost of the Assembled PCB / 51.11 51.9 How to Develop Acceptability and Quality Criteria / 51.11 51.10 Class of Service / 51.13 51.11 Inspection Criteria / 51.13 51.12 Reliability Inspection Using Accelerated Environmental Exposure / 51.32 CONTENTS xv Chapter 52. Acceptability of Printed Circuit Board Assemblies 52.1 52.1 Understanding Customer Requirements / 52.1 52.2 Handling to Protect the PCBA / 52.7 52.3 PCBA Hardware Acceptability Considerations / 52.10 52.4 Component Installation or Placement Requirements / 52.15 52.5 Component and PCB Solderability Requirements / 52.25 52.6 Solder-Related Defects / 52.25 52.7 PCBA Laminate Condition, Cleanliness, and Marking Requirements / 52.32 52.8 PCBA Coatings / 52.34 52.9 Solderless Wrapping of Wire to Posts (Wire Wrap) / 52.35 52.10 PCBA Modifications / 52.37 References / 52.39 Chapter 53. Assembly Inspection 53.1 53.1 Introduction / 53.1 53.2 Definition of Defects, Faults, Process Indicators, and Potential Defects / 53.3 53.3 Reasons for Inspection / 53.4 53.4 Lead-Free Impact on Inspection / 53.6 53.5 Miniaturization and Higher Complexity / 53.8 53.6 Visual Inspection / 53.8 53.7 Automated Inspection / 53.12 53.8 Three-Dimensional Automated Solder Paste Inspection / 53.14 53.9 PRE-Reflow Aoi / 53.16 53.10 Post-Reflow Automated Inspection / 53.17 53.11 Implementation of Inspection Systems / 53.23 53.12 Design Implications of Inspection Systems / 53.24 References / 53.25 Chapter 54. Design for Testing 54.1 54.1 Introduction / 54.1 54.2 Definitions / 54.2 54.3 AD HOC Design for Testability / 54.2 54.4 Structured Design for Testability / 54.4 54.5 Standards-Based Testing / 54.5 References / 54.12 Chapter 55. Loaded Board Testing 55.1 55.1 Introduction / 55.1 55.2 The process of Test / 55.1 55.3 Definitions / 55.4 55.4 Testing Approaches / 55.7 55.5 In-Circuit Test Techniques / 55.11 55.6 Alternatives to Conventional Electrical Tests / 55.17 55.7 Tester Comparison / 55.19 References / 55.20 Part 13 Reliability Chapter 56. Conductive Anodic Filament Formation 56.3 56.1 Introduction / 56.3 56.2 Understanding CAF Formation / 56.3 xvi CONTENTS 56.3 Electrochemical Migration and Formation of CAF / 56.7 56.4 Factors that Affect CAF Formation / 56.10 56.5 Test Method for CAF-Resistant Materials / 56.14 56.6 Manufacturing Tolerance Considerations / 56.14 References / 56.15 Chapter 57. Reliability of Printed Circuit Assemblies 57.1 57.1 Fundamentals of Reliability / 57.2 57.2 Failure Mechanisms of PCBS and Their Interconnects / 57.4 57.3 Influence of Design on Reliability / 57.19 57.4 Impact of PCB Fabrication and Assembly on Reliability / 57.20 57.5 Influence of Materials Selection on Reliability / 57.27 57.6 Burn-in, Acceptance Testing, and Accelerated Reliability Testing / 57.36 57.7 Summary / 57.45 References / 57.45 Further Reading / 57.47 Chapter 58. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free 58.1 58.1 Introduction / 58.1 58.2 Packaging Challenges / 58.2 58.3 Variables that Impact Reliability / 58.5 References / 58.30 Chapter 59. Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders 59.1 59.1 Introduction / 59.1 59.2 Thermomechanical Reliability / 59.3 59.3 Mechanical Reliability / 59.20 59.4 Finite Element Analysis (FEA) / 59.27 References / 59.35 Part 14 Environmental Issues Chapter 60. Process Waste Minimization and Treatment 60.3 60.1 Introduction / 60.3 60.2 Regulatory Compliance / 60.3 60.3 Major Sources and Amounts of Wastewater in a Printed Circuit Board Fabrication Facility / 60.5 60.4 Waste Minimization / 60.6 60.5 Pollution Prevention Techniques / 60.8 60.6 Recycling and Recovery Techniques / 60.15 60.7 Alternative Treatments / 60.18 60.8 Chemical Treatment Systems / 60.21 60.9 Advantages and Disadvantages of Various Treatment Alternatives / 60.26 CONTENTS xvii Part 15 Flexible Circuits Chapter 61. Flexible Circuit Applications and Materials 61.3 61.1 Introduction to Flexible Circuits / 61.3 61.2 Applications of Flexible Circuits / 61.6 61.3 High-Density Flexible Circuits / 61.6 61.4 Materials for Flexible Circuits / 61.8 61.5 Substrate Material Properties / 61.9 61.6 Conductor Materials / 61.13 61.7 Copper-Clad Laminates / 61.14 61.8 Coverlay Material / 61.19 61.9 Stiffener Materials / 61.22 61.10 Adhesive materials / 61.22 61.11 Restriction of Hazardous Substances (RoHS) Issues / 61.23 Chapter 62. Design of Flexible Circuits 62.1 62.1 Introduction / 62.1 62.2 Design Procedure / 62.1 62.3 Types of Flexible Circuits / 62.2 62.4 Circuit Designs for Flexibility / 62.12 62.5 Electrical Design of the Circuits / 62.15 62.6 Circuit Designs for Higher Reliability / 62.16 62.7 Circuit Designs for RoHS Compliance / 62.17 Chapter 63. Manufacturing of Flexible Circuits 63.1 63.1 Introduction / 63.1 63.2 Special Issues with HDI Flexible Circuits / 63.1 63.3 Basic Process Elements / 63.3 63.4 New Processes for Fine Traces / 63.14 63.5 Coverlay Processes / 63.24 63.6 Surface Treatment / 63.30 63.7 Blanking / 63.31 63.8 Stiffener Processes / 63.33 63.9 Packaging / 63.33 63.10 Roll-to-Roll Manufacturing / 63.34 63.11 Dimension Control / 63.36 Chapter 64. Termination of Flexible Circuits 64.1 64.1 Introduction / 64.1 64.2 Selection of Termination Technologies / 64.1 64.3 Permanent Connections / 64.4 64.4 Semipermanent Connections / 64.11 64.5 Nonpermanent Connections / 64.13 64.6 High-Density Flexible Circuit Termination / 64.20 Chapter 65. Multilayer Flex and Rigid/Flex 65.1 65.1 Introduction / 65.1 65.2 Multilayer Rigid/flex / 65.1 xviii CONTENTS Chapter 66. Special Constructions of Flexible Circuits 66.1 66.1 Introduction / 66.1 66.2 Flying-Lead Construction / 66.1 66.3 Tape Automated Bonding / 66.8 66.4 Microbump Arrays / 66.10 66.5 Thick-Film Conductor Flex Circuits / 66.12 66.6 Shielding of the Flexible Cables / 66.13 66.7 Functional Flexible Circuits / 66.14 Chapter 67. Quality Assurance of Flexible Circuits 67.1 67.1 Introduction / 67.1 67.2 Basic Concepts in Flexible Circuit Quality Assurance / 67.1 67.3 Automatic Optical Inspection Systems / 67.2 67.4 Dimensional Measurements / 67.3 67.5 Electrical Tests / 67.3 67.6 Inspection Sequence / 67.3 67.7 Raw Materials / 67.6 67.8 Flexible Circuit Feature Inspection / 67.6 67.9 Standards and Specifications for Flexible Circuits / 67.8 Appendix A.1 Glossary G.1 Index I.1 ...展开收缩
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