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  1. Universal Serial Bus

  2. Connection of the PC to the telephone It is well understood that the merge of computing and communication will be the basis for the next generation of productivity applications. The movement of machine-oriented and human-oriented data types from one
  3. 所属分类:其它

    • 发布日期:2009-05-09
    • 文件大小:5242880
    • 提供者:hanshui77
  1. USB Spec 2.0-USB规范

  2. It is well understood that the merge of computing and communication will be the basis for the next generation of productivity applications. The movement of machine-oriented and human-oriented data types from one location or environment to another de
  3. 所属分类:其它

    • 发布日期:2009-07-28
    • 文件大小:5242880
    • 提供者:weiwei916
  1. Digital Signal Integrity-Modeling and Simulation with Interconnects and Package

  2. Digital Signal Integrity-Modeling and Simulation with Interconnects and Package
  3. 所属分类:专业指导

    • 发布日期:2009-08-04
    • 文件大小:16777216
    • 提供者:lee_chenkung
  1. Essential Linux Device Drivers

  2. Table of Contents| Index Copyright Prentice Hall Open Source Software Development Series Foreword Preface Acknowledgments About the Author Chapter 1. Introduction Evolution The GNU Copyleft Kernel.org Mailing Lists and Forums Linux Distributions L o
  3. 所属分类:Linux

    • 发布日期:2009-09-04
    • 文件大小:4194304
    • 提供者:ekin1999
  1. Digital Signal Integrity-Modeling and Simulation with Interconnects and Package

  2. Digital Signal Integrity-Modeling and Simulation with Interconnects and Package
  3. 所属分类:专业指导

    • 发布日期:2009-12-01
    • 文件大小:16777216
    • 提供者:botter20002003
  1. Multiprocessor+Systems-on-Chips

  2. 以下的资源也很不错, 加减可以看一下o 使用C++制作3D动画人物-100%提供源码 http://download.csdn.net/source/2255453 http://hqioan.download.csdn.net/ The What, Why, and How of MPSoCs 1 Ahmed Amine Jerraya and Wayne Wolf 1.1 Introduction 1 1.2 What are MPSoCs 1 1.3 Why MPSoCs? 5 1.4
  3. 所属分类:硬件开发

    • 发布日期:2010-01-10
    • 文件大小:2097152
    • 提供者:hqioan
  1. VPX标准规范之一/ VITA46.0 Draft Standard

  2. Abstract This standard describes VITA 46.0 Advanced Module Format for VMEbus systems, an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. Foreword VME has been the de-facto bus standard for C
  3. 所属分类:硬件开发

    • 发布日期:2010-02-23
    • 文件大小:1048576
    • 提供者:calvinj88
  1. Allan F. Bower 编写的应用固体力学

  2. Solid Mechanics is a collection of physical laws, mathematical techniques, and computer algorithms that can be used to predict the behavior of a solid material that is subjected to mechanical or thermal loading. The field has a wide range of applica
  3. 所属分类:专业指导

    • 发布日期:2010-02-28
    • 文件大小:16777216
    • 提供者:yutiantanglili
  1. Universal Serial Bus Specification

  2. USB2.0协议 It is well understood that the merge of computing and communication will be the basis for the ne generation of productivity applications. The movement of machine-oriented and human-oriented types from one location or environment to another
  3. 所属分类:其它

    • 发布日期:2010-04-05
    • 文件大小:5242880
    • 提供者:frogsky106
  1. Printed Circuits Handbook

  2. 印刷电路板手册第六版 Part 1 Lead-Free Legislation Chapter 1. Legislation and Impact on Printed Circuits 1.3 1.1 Legislation Overview / 1.3 1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3 1.3 Restriction of Hazardous Substances (RoHS) / 1.3 1.4 RoHS
  3. 所属分类:Web开发

    • 发布日期:2010-04-24
    • 文件大小:13631488
    • 提供者:ic2003
  1. USB_Universal Serial Bus Specification.pdf

  2. Universal Serial Bus Specification Revision 1.1 1 Chapter 1 Introduction 1.1 Motivation The motivation for the Universal Serial Bus (USB) comes from three interrelated considerations:  Connection of the PC to the telephone It is well understood tha
  3. 所属分类:Web开发

    • 发布日期:2010-04-27
    • 文件大小:1048576
    • 提供者:guijinwen2008
  1. 32-Bit Accumulate PSoC片上系统

  2. The PSoC architecture, as illustrated on the left, is comprised of four main areas: PSoC Core, Digital System, Analog System, and System Resources. Configurable global busing allows all the device resources to be combined into a complete custom syst
  3. 所属分类:Access

    • 发布日期:2010-07-12
    • 文件大小:553984
    • 提供者:zhukaiping
  1. Digital Signal Integrity-Modeling and Simulation with Interconnects and Package.

  2. Digital Signal Integrity-Modeling and Simulation with Interconnects and Package.
  3. 所属分类:专业指导

    • 发布日期:2014-07-03
    • 文件大小:16777216
    • 提供者:bianttyy
  1. Energy-Energy-Efficient VCSELs for Optical Interconnects 2016.pdf

  2. © Springer International Publishing Switzerland 2016 VCSEL 垂直腔面发射激光器 Vertical Cavity Surface Emitting Laser The present Ph.D. thesis represents the first systematic investigation of the dynamic energy efficiency of vertical-cavity surface-emitting l
  3. 所属分类:专业指导

    • 发布日期:2017-12-27
    • 文件大小:8388608
    • 提供者:qq_37931027
  1. Study on crosstalk fault model and testing for SoC inter-core interconnects

  2. Signal integrity testing for inter-cores in SoC has become an important issue within DSM manufacturing technology and GHz working frequency of VLSI. A new testing method for SoC inter-core interconnects is presented in this paper. Properties and prin
  3. 所属分类:其它

    • 发布日期:2021-02-21
    • 文件大小:187392
    • 提供者:weixin_38721119
  1. Circuit modeling and performance analysis of SWCNT bundle 3D interconnects

  2. Circuit modeling and performance analysis of SWCNT bundle 3D interconnects
  3. 所属分类:其它

    • 发布日期:2021-02-10
    • 文件大小:586752
    • 提供者:weixin_38712279
  1. Performance analysis of single-walled carbon nanotube bundle interconnects for three-dimensional integration application

  2. Performance analysis of single-walled carbon nanotube bundle interconnects for three-dimensional integration applications
  3. 所属分类:其它

    • 发布日期:2021-02-10
    • 文件大小:355328
    • 提供者:weixin_38608866
  1. Modeling and Fast Simulation of Multiwalled Carbon Nanotube Interconnects

  2. Modeling and Fast Simulation of Multiwalled Carbon Nanotube Interconnects
  3. 所属分类:其它

    • 发布日期:2021-02-08
    • 文件大小:1017856
    • 提供者:weixin_38651507
  1. Investigation of Copper-Carbon Nanotube Composites as Global VLSI Interconnects

  2. Investigation of Copper-Carbon Nanotube Composites as Global VLSI Interconnects
  3. 所属分类:其它

    • 发布日期:2021-02-08
    • 文件大小:1048576
    • 提供者:weixin_38708223
  1. High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]

  2. One of the most serious challenges facing exponential performance growth in the information industry is the bandwidth bottleneck in interchip interconnects. We propose a photonics–electronics convergence system in response to this issue. To demonstra
  3. 所属分类:其它

    • 发布日期:2021-02-05
    • 文件大小:1048576
    • 提供者:weixin_38719719
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