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  1. Physical interpretation of parameters in synergistic continuum damage mechanics model for laminates

  2. The continuum damage mechanics (CDM) model by Talreja [Talreja R. Damage characterization by internal variables. In: Pipes RB, Talreja R, editors. Comput Mater Series, vol. 9. Dam Mech Comp Mater, Elsevier, Amsterdam; 1994, p. 53–78], which is one o
  3. 所属分类:其它

    • 发布日期:2009-08-07
    • 文件大小:669696
    • 提供者:dp1025
  1. Printed Circuits Handbook

  2. 印刷电路板手册第六版 Part 1 Lead-Free Legislation Chapter 1. Legislation and Impact on Printed Circuits 1.3 1.1 Legislation Overview / 1.3 1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3 1.3 Restriction of Hazardous Substances (RoHS) / 1.3 1.4 RoHS
  3. 所属分类:Web开发

    • 发布日期:2010-04-24
    • 文件大小:13631488
    • 提供者:ic2003
  1. gensys RF board design flow

  2. Trends • More complex multilayer, multifunctional RF boards • Higher integration of different technologies like RF and Multichip Modules (MCM), die-in-board,... • 3D Stacking of board laminates with Multichip Modules and RF wireless technologies
  3. 所属分类:专业指导

    • 发布日期:2011-08-29
    • 文件大小:1048576
    • 提供者:numen1979
  1. PCB常识教程

  2. PCB基板材料   覆铜箔层压板(Copper Clad Laminates,简写为CCL)简称覆铜箔板或覆铜板,在整个印制电路板上,主要担负着导电、绝缘和支撑三个方面的功能。
  3. 所属分类:讲义

    • 发布日期:2015-07-01
    • 文件大小:139264
    • 提供者:qq_29446229
  1. Impact evaluation in carbon fiber reinforced plastic (CFRP) laminates using eddy current pulsed thermography

  2. With the growing interest to use engineering composite structures, much attention is devoted to the development of non-destructive testing (NOT) techniques for impact evaluation. Eddy current pulsed thermography (ECPT) is an emerging NOT technique, w
  3. 所属分类:其它

    • 发布日期:2021-02-09
    • 文件大小:4194304
    • 提供者:weixin_38577648