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  1. Mechanical Behavior of Materials (1)

  2. Chapter 1 Materials: Structure, Properties, and Performance 1 1.1 Introduction 1 1.2 Monolithic, Composite, and Hierarchical Materials 3 1.3 Structure of Materials 15 1.3.1 Crystal Structures 16 1.3.2 Metals 19 1.3.3 Ceramics 25 1.3.4 Glasses 30 1.3
  3. 所属分类:C#

    • 发布日期:2009-07-05
    • 文件大小:10485760
    • 提供者:xw_bai
  1. Mechanical Behavior of Materials (2)

  2. Chapter 1 Materials: Structure, Properties, and Performance 1 1.1 Introduction 1 1.2 Monolithic, Composite, and Hierarchical Materials 3 1.3 Structure of Materials 15 1.3.1 Crystal Structures 16 1.3.2 Metals 19 1.3.3 Ceramics 25 1.3.4 Glasses 30 1.3
  3. 所属分类:C#

    • 发布日期:2009-07-05
    • 文件大小:5242880
    • 提供者:xw_bai
  1. ide TO sata

  2. JMicron and the JMicron Logo are trademarks of JMicron Technology Corporation in Taiwan and/or other countries. Other company, product and service names may be trademarks or service marks of others. All information contained in this document is subj
  3. 所属分类:其它

    • 发布日期:2009-10-27
    • 文件大小:1048576
    • 提供者:zhgs032
  1. SEMICONDUCTOR MATERIAL AND DEVICE

  2. The resistivity ρ of a semiconductor is important for starting material as well as for semiconductor devices. Although carefully controlled during crystal growth, it is not truly uniform in the grown ingot due to variability during growth and segreg
  3. 所属分类:其它

    • 发布日期:2010-03-18
    • 文件大小:11534336
    • 提供者:anthony_inverson
  1. VLSI Fabrication Principles, Silicon and Gallium Arsenide

  2. 超大规模集成电路制造技术,同志们,超好的一本当代用书! Summary: Fully updated with the latest technologies, this edition covers the fundamental principles underlying fabrication processes for semiconductor devices along with integrated circuits made from silicon and gallium a
  3. 所属分类:电信

    • 发布日期:2012-01-07
    • 文件大小:39845888
    • 提供者:microangelos
  1. ION IMPLANTATION

  2. 离子注入较新的材料,由Mark Goorsky编辑并发布,是几篇很不错的半导体行业制造相关的研究报告。
  3. 所属分类:制造

    • 发布日期:2018-10-20
    • 文件大小:36700160
    • 提供者:liaoqichao
  1. Influence of ion- implantation on the effective Schottky barrier height of NiGe/n-Ge contacts

  2. 离子注入对NiGe/n-Ge接触肖特基势垒高度的影响研究,李成,汤梦饶,在镍锗/n锗接触中用掺杂来调制有效肖特基势垒高度的方法仍然存在争议。本文实验证明离子损伤比界面钝化在注入硒和硅的镍锗/n锗接�
  3. 所属分类:其它

    • 发布日期:2020-03-13
    • 文件大小:611328
    • 提供者:weixin_38747087
  1. Fabrication and characterization of Ag-implantation modificated TiO2 films followed with thermal annealing

  2. Ag离子注入后退火对TiO2薄膜光催化性能的影响研究,肖湘衡,徐进霞,Ag离子注入TiO2退火后,Ag离子进入TiO2的晶格形成了Ag2O和TiO2的混合氧化物。Ag2O是禁带宽度比较小的半导体,其禁带宽度约为1.2 eV [130]。TiO
  3. 所属分类:其它

    • 发布日期:2020-02-09
    • 文件大小:320512
    • 提供者:weixin_38625464
  1. Fabrication and evolution of nanostructure in Al2O3 single crystals by Zn+ ions implantation and thermal annealing

  2. Zn离子注入单晶Al2O3并退火制备ZnO纳米结构,徐进霞,张红秀,将能量为60 keV的Zn+注入到[0001]α-Al2O3 单晶 (蓝宝石),注入剂量为 1×1017 ions/cm2 和 2×1017 ions/cm2,然后将样品在氧气氛下不同温度退火。用�
  3. 所属分类:其它

    • 发布日期:2020-01-07
    • 文件大小:591872
    • 提供者:weixin_38678510
  1. germanium-p-channel-qwfet-cmos-paper.pdf

  2. 锗(旧译作鈤 )是一种化学元素,它的化学符号是Ge,原子序数是32,原子量72.64。在化学元素周期表中位于第4周期、第IVA族。锗单质是一种灰白色准金属,有光泽,质硬,属于碳族,化学性质与同族的锡与硅相近,不溶于水、盐酸、稀苛性碱溶液,溶于王水、浓硝酸或硫酸,具有两性,故溶于熔融的碱、过氧化碱、碱金属硝酸盐或碳酸盐,在空气中较稳定,在自然界中,锗共有五种同位素:70,72,73,74,76,在700℃以上与氧作用生成GeO2,在1000℃以上与氢作用,细粉锗能在氯或溴中燃烧,锗是优良半导体,可
  3. 所属分类:专业指导

    • 发布日期:2019-10-13
    • 文件大小:745472
    • 提供者:uhhhhhhh
  1. sprocess_ug.pdf

  2. Swb maunual , TCAD 仿真软件应用手册, sentaurus, sprocessContents About This Guide XXX Audi XXXII Related Publications .,....,.XXX1 Typographic Conventions ....,,,,,..,.......XXX11 Customer Support..... Accessing SolvNet XXXII Contacting Synopsys Support Cont
  3. 所属分类:制造

    • 发布日期:2019-10-06
    • 文件大小:8388608
    • 提供者:simpleface
  1. - Ieee Analog Circuit Design -1 .pdf

  2. 吴重雨,IEEE 2000年讲义,模拟集成电路设计,从原理到应用,适合学习入门3. Roubik Gregorian and gabor c. Temes. Analog mos Integrated Circuits for Signal Processing, John Wiley sons, 1987 4. Technical Papers Final scores: Will be determined by (1)Homework 20% (2)Mid-Term Test 30% (3
  3. 所属分类:讲义

    • 发布日期:2019-07-27
    • 文件大小:29360128
    • 提供者:young200
  1. Silicon Processing for the VLSI Era, Vol. 4_

  2. 集成电路工艺:Deep-submicron process technology Describe such deep-submicron process technology and intended to provide semiconductor engineers and researchers with a comprehensive , state-of-the-art reference about these emerging and leading-edge process.C
  3. 所属分类:电信

    • 发布日期:2019-07-05
    • 文件大小:83886080
    • 提供者:yingjunjun01
  1. Deep N Well instruction.pdf

  2. Impact of Deep N-well Implantation on Substrate Noise Coupling and RF Transistor Performance for Systems-on-a-Chip Integration
  3. 所属分类:制造

    • 发布日期:2020-07-23
    • 文件大小:906240
    • 提供者:weixin_45101218
  1. Investigation of low-temperature cathodoluminescence mechanism of Er-doped GaN thick films by ion implantation

  2. Er ions are implanted into the GaN thick films grown by hydride vapor phase epitaxy. The implantation energy is 200 keV and the implantation doses are 1×1013, 1×1014, 1×1015, and 5×1015 atom/cm2, respectively. The effects of the implantation dose and
  3. 所属分类:其它

    • 发布日期:2021-02-23
    • 文件大小:294912
    • 提供者:weixin_38717574
  1. Optical and Electrical Properties of Single-Crystal Si Supersaturated with Se by Ion Implantation

  2. Optical and Electrical Properties of Single-Crystal Si Supersaturated with Se by Ion Implantation
  3. 所属分类:其它

    • 发布日期:2021-02-21
    • 文件大小:578560
    • 提供者:weixin_38572979
  1. Effect of Sn implantation on thermal stability improvement of NiSiGe

  2. Effect of Sn implantation on thermal stability improvement of NiSiGe
  3. 所属分类:其它

    • 发布日期:2021-02-11
    • 文件大小:700416
    • 提供者:weixin_38501810
  1. Synthesis of Layer-Tunable Graphene: A Combined Kinetic Implantation and Thermal Ejection Approach

  2. Synthesis of Layer-Tunable Graphene: A Combined Kinetic Implantation and Thermal Ejection Approach
  3. 所属分类:其它

    • 发布日期:2021-02-10
    • 文件大小:3145728
    • 提供者:weixin_38742520
  1. The effect of proton implantation on photoluminescence from ensembles of InAs quantum dots embedded in GaAs

  2. The effect of proton implantation on photoluminescence from ensembles of InAs quantum dots embedded in GaAs
  3. 所属分类:其它

    • 发布日期:2021-02-10
    • 文件大小:354304
    • 提供者:weixin_38699724
  1. Enhancement-mode AlGaN/GaN HEMTs with thin and high Al composition barrier layers using O2 plasma implantation

  2. Enhancement-mode AlGaN/GaN HEMTs with thin and high Al composition barrier layers using O2 plasma implantation
  3. 所属分类:其它

    • 发布日期:2021-02-10
    • 文件大小:653312
    • 提供者:weixin_38576922
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